by Dunworth, J. D., Homayoun, A., Ku, B.-H, Ou, Y.-C, Chakraborty, K., Liu, G., Segoria, T., Lerdworatawee, J., Park, J. W., Park, H.-C, Hedayati, H., Lu, D., Monat, P., Douglas, K., Aparin, V.
Published in 2018 IEEE International Solid - State Circuits Conference - (ISSCC) (01.02.2018)