by Johnson, S., Resnick, D.J., Mancini, D., Nordquist, K., Dauksher, W.J., Gehoski, K., Baker, J.H., Dues, L., Hooper, A., Bailey, T.C., Sreenivasan, S.V., Ekerdt, J.G., Willson, C.G.
Published in Microelectronic engineering (01.06.2003)