EMI from cavity modes of shielding enclosures-FDTD modeling and measurements
Min Li, Nuebel, J., Drewniak, J.L., DuBroff, R.E., Hubing, T.H., van Doren, T.P.
Published in IEEE transactions on electromagnetic compatibility (01.02.2000)
Published in IEEE transactions on electromagnetic compatibility (01.02.2000)
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Journal Article
Calibration and compensation of near-field scan measurements
Jin Shi, Cracraft, M.A., Slattery, K.P., Yamaguchi, M., DuBroff, R.E.
Published in IEEE transactions on electromagnetic compatibility (01.08.2005)
Published in IEEE transactions on electromagnetic compatibility (01.08.2005)
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Journal Article
Power-bus decoupling with embedded capacitance in printed circuit board design
Minjia Xu, Hubing, T.H., Chen, J., Van Doren, T.P., Drewniak, J.L., DuBroff, R.E.
Published in IEEE transactions on electromagnetic compatibility (01.02.2003)
Published in IEEE transactions on electromagnetic compatibility (01.02.2003)
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Journal Article
DC power-bus noise isolation with power-plane segmentation
Wei Cui, Jun Fan, Yong Ren, Hao Shi, Drewniak, J.L., DuBroff, R.E.
Published in IEEE transactions on electromagnetic compatibility (01.05.2003)
Published in IEEE transactions on electromagnetic compatibility (01.05.2003)
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Journal Article
Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs
Jun Fan, Drewniak, J.L., Knighten, J.L., Smith, N.W., Orlandi, A., Van Doren, T.P., Hubing, T.H., DuBroff, R.E.
Published in IEEE transactions on electromagnetic compatibility (01.11.2001)
Published in IEEE transactions on electromagnetic compatibility (01.11.2001)
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Journal Article
EMI mitigation with multilayer power-bus stacks and via stitching of reference planes
Xiaoning Ye, Hockanson, D.A., Min Li, Yong Ren, Wei Cui, Drewniak, J.L., DuBroff, R.E.
Published in IEEE transactions on electromagnetic compatibility (01.11.2001)
Published in IEEE transactions on electromagnetic compatibility (01.11.2001)
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Journal Article
An EMI estimate for shielding-enclosure evaluation
Min Li, Drewniak, J.L., Radu, S., Nuebel, J., Hubing, T.H., DuBroff, R.E., van Doren, T.P.
Published in IEEE transactions on electromagnetic compatibility (01.08.2001)
Published in IEEE transactions on electromagnetic compatibility (01.08.2001)
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Journal Article
EMI reduction from airflow aperture arrays using dual-perforated screens and loss
Min Li, Nuebel, J., Drewniak, J.L., Hubing, T.H., DuBroff, R.E., Van Doren, T.P.
Published in IEEE transactions on electromagnetic compatibility (01.05.2000)
Published in IEEE transactions on electromagnetic compatibility (01.05.2000)
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Journal Article
Power bus isolation using power islands in printed circuit boards
Chen, J., Hubing, T.H., Van Doren, T.P., DuBroff, R.E.
Published in IEEE transactions on electromagnetic compatibility (01.05.2002)
Published in IEEE transactions on electromagnetic compatibility (01.05.2002)
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Journal Article
Frequency-Domain Probe Characterization and Compensation Using Reciprocity
Haixiao Weng, Beetner, D G, DuBroff, R E
Published in IEEE transactions on electromagnetic compatibility (01.02.2011)
Published in IEEE transactions on electromagnetic compatibility (01.02.2011)
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Journal Article
EMI considerations in selecting heat-sink-thermal-gasket materials
Yu Huang, Butler, J.E., de Sorgo, M., DuBroff, R.E., Hubing, T.H., Drewniak, J.L., van Doren, T.P.
Published in IEEE transactions on electromagnetic compatibility (01.08.2001)
Published in IEEE transactions on electromagnetic compatibility (01.08.2001)
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Journal Article