Estimation of High-Frequency Currents From Near-Field Scan Measurements
Haixiao Weng, Beetner, D.G., DuBroff, R.E., Jin Shi
Published in IEEE transactions on electromagnetic compatibility (01.11.2007)
Published in IEEE transactions on electromagnetic compatibility (01.11.2007)
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Journal Article
Calibration and compensation of near-field scan measurements
Jin Shi, Cracraft, M.A., Slattery, K.P., Yamaguchi, M., DuBroff, R.E.
Published in IEEE transactions on electromagnetic compatibility (01.08.2005)
Published in IEEE transactions on electromagnetic compatibility (01.08.2005)
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Journal Article
Reconstruction of Dispersive Dielectric Properties for PCB Substrates Using a Genetic Algorithm
Jianmin Zhang, Koledintseva, M.Y., Drewniak, J.L., Pommerenke, D.J., DuBroff, R.E., Zhiping Yang, Wheling Cheng, Rozanov, K.N., Antonini, G., Orlandi, A.
Published in IEEE transactions on electromagnetic compatibility (01.08.2008)
Published in IEEE transactions on electromagnetic compatibility (01.08.2008)
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Journal Article
Power-bus decoupling with embedded capacitance in printed circuit board design
Minjia Xu, Hubing, T.H., Chen, J., Van Doren, T.P., Drewniak, J.L., DuBroff, R.E.
Published in IEEE transactions on electromagnetic compatibility (01.02.2003)
Published in IEEE transactions on electromagnetic compatibility (01.02.2003)
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Journal Article
EMI from cavity modes of shielding enclosures-FDTD modeling and measurements
Min Li, Nuebel, J., Drewniak, J.L., DuBroff, R.E., Hubing, T.H., van Doren, T.P.
Published in IEEE transactions on electromagnetic compatibility (01.02.2000)
Published in IEEE transactions on electromagnetic compatibility (01.02.2000)
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Journal Article
DC power-bus noise isolation with power-plane segmentation
Wei Cui, Jun Fan, Yong Ren, Hao Shi, Drewniak, J.L., DuBroff, R.E.
Published in IEEE transactions on electromagnetic compatibility (01.05.2003)
Published in IEEE transactions on electromagnetic compatibility (01.05.2003)
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Journal Article
Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs
Jun Fan, Drewniak, J.L., Knighten, J.L., Smith, N.W., Orlandi, A., Van Doren, T.P., Hubing, T.H., DuBroff, R.E.
Published in IEEE transactions on electromagnetic compatibility (01.11.2001)
Published in IEEE transactions on electromagnetic compatibility (01.11.2001)
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Journal Article
EMI mitigation with multilayer power-bus stacks and via stitching of reference planes
Xiaoning Ye, Hockanson, D.A., Min Li, Yong Ren, Wei Cui, Drewniak, J.L., DuBroff, R.E.
Published in IEEE transactions on electromagnetic compatibility (01.11.2001)
Published in IEEE transactions on electromagnetic compatibility (01.11.2001)
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Journal Article
An EMI estimate for shielding-enclosure evaluation
Min Li, Drewniak, J.L., Radu, S., Nuebel, J., Hubing, T.H., DuBroff, R.E., van Doren, T.P.
Published in IEEE transactions on electromagnetic compatibility (01.08.2001)
Published in IEEE transactions on electromagnetic compatibility (01.08.2001)
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Journal Article
Power bus isolation using power islands in printed circuit boards
Chen, J., Hubing, T.H., Van Doren, T.P., DuBroff, R.E.
Published in IEEE transactions on electromagnetic compatibility (01.05.2002)
Published in IEEE transactions on electromagnetic compatibility (01.05.2002)
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Journal Article
EMI reduction from airflow aperture arrays using dual-perforated screens and loss
Min Li, Nuebel, J., Drewniak, J.L., Hubing, T.H., DuBroff, R.E., Van Doren, T.P.
Published in IEEE transactions on electromagnetic compatibility (01.05.2000)
Published in IEEE transactions on electromagnetic compatibility (01.05.2000)
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Journal Article
EMI considerations in selecting heat-sink-thermal-gasket materials
Yu Huang, Butler, J.E., de Sorgo, M., DuBroff, R.E., Hubing, T.H., Drewniak, J.L., van Doren, T.P.
Published in IEEE transactions on electromagnetic compatibility (01.08.2001)
Published in IEEE transactions on electromagnetic compatibility (01.08.2001)
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Journal Article
An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances
Chen Wang, Jingkun Mao, Selli, G., Shaofeng Luan, Lin Zhang, Jun Fan, Pommerenke, D.J., DuBroff, R.E., Drewniak, J.L.
Published in IEEE transactions on advanced packaging (01.05.2006)
Published in IEEE transactions on advanced packaging (01.05.2006)
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Journal Article
Measurement of electromagnetic parameters and FDTD modeling of ferrite cores
Jianfeng Xu, Koledintseva, M.Y., Yongxue He, DuBroff, R.E., Drewniak, J.L., Matlin, B., Orlando, A.
Published in 2009 IEEE International Symposium on Electromagnetic Compatibility (01.08.2009)
Published in 2009 IEEE International Symposium on Electromagnetic Compatibility (01.08.2009)
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Conference Proceeding
Predicting TEM cell measurements from near field scan data
Haixiao Weng, Beetner, D.G., DuBroff, R.E.
Published in 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006 (2006)
Published in 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006 (2006)
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Conference Proceeding
Predictive Modeling of the Effects of Skew and Imbalance on Radiated EMI from Cables
Chen, J., Drewniak, J.L., DuBroff, R.E., Knighten, J.L., Fan, J., Flavin, J.
Published in 2007 IEEE International Symposium on Electromagnetic Compatibility (01.07.2007)
Published in 2007 IEEE International Symposium on Electromagnetic Compatibility (01.07.2007)
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Conference Proceeding
Signal link-path characterization up to 20 GHz based on a stripline structure
Jianmin Zhang, Drewniak, J.L., Pommerenke, D.J., DuBroff, R.E., Zhiping Yang, Wheling Cheng, Fisher, J., Camerlo, S.
Published in 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006 (2006)
Published in 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006 (2006)
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Conference Proceeding