20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering
Ji, Xinrui, Du, Leiming, van Zeijl, Henk, Zhang, Guoqi, Derakhshandeh, Jaber, Beyne, Eric
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films
Ji, Xinrui, Van Zeijl, Henk, Jiao, Weiping, He, Shan, Du, Leiming, Zhang, Guoqi
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material
Du, Leiming, Zhao, Xiujuan, Poelma, Rene, Van Driel, Willem, Zhang, Guoqi
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects
Du, Leiming, Zhao, Xiujuan, Watte, Piet, Poelma, Rene, Van Driel, Willem, Zhang, Guoqi
Published in IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society (17.10.2022)
Published in IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society (17.10.2022)
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Conference Proceeding
Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices
Du, Leiming, Hu, Dong, Poelm, Rene, Driel, Willem Van, Zhang, Kouchi
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
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Conference Proceeding
Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures
Mo, Jiarui, Schaffar, Gerald J.K., Du, Leiming, Maier-Kiener, Verena, Kiener, Daniel, Vollebregt, Sten, Zhang, Guoqi
Published in 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) (21.01.2024)
Published in 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) (21.01.2024)
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Conference Proceeding
The correlations of multi-wave band luminosity and BLR luminosity in Fermi 2LAC blazars
Wang, Zerui, Xue, Rui, Xie, Zhaohua, Du, Leiming, Tingfeng Yi, Xu, Yunbing, Liu, Wenguang
Published in arXiv.org (28.08.2017)
Published in arXiv.org (28.08.2017)
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Paper
Journal Article
On estimators of the jet bolometric luminosity of Fermi 2LAC blazars
Wang, Zerui, Xue, Rui, Du, Leiming, Xie, Zhaohua, Xiong, Dingrong, Tingfeng Yi, Xu, Yunbing, Liu, Wenguang
Published in arXiv.org (20.07.2017)
Published in arXiv.org (20.07.2017)
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Paper
Journal Article
CHARGING AND HEAT PRESERVATION METHOD AND SYSTEM FOR VEHICLE BATTERY
SONG, Dandan, SONG, Haijun, WU, Maiqing, LIU, Zhiwei, LI, Lei, DU, Leiming
Year of Publication 17.01.2024
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Year of Publication 17.01.2024
Patent