Strengthening in Mg–Li matrix composites
Trojanová, Z., Drozd, Z., Kúdela, S., Száraz, Z., Lukáč, P.
Published in Composites science and technology (01.07.2007)
Published in Composites science and technology (01.07.2007)
Get full text
Journal Article
Mechanical and physical properties of selected magnesium base nanocomposites
Drozd, Z, Trojanová, Z, Lukáč, P, Kučeráková, M, Václavů, T
Published in IOP conference series. Materials Science and Engineering (01.06.2018)
Published in IOP conference series. Materials Science and Engineering (01.06.2018)
Get full text
Journal Article
A reliability study of the lead-free solder connections of miniature chip components on hybrid circuits
Ročak, D., Maček, S., Sitek, J., Hrovat, M., Bukat, K., Drozd, Z.
Published in Microelectronics and reliability (01.06.2007)
Published in Microelectronics and reliability (01.06.2007)
Get full text
Journal Article
Deformation behaviour of Mg–Li–Al alloys
Drozd, Zdeněk, Trojanová, Zuzanka, Kúdela, Stanislav
Published in Journal of alloys and compounds (22.09.2004)
Published in Journal of alloys and compounds (22.09.2004)
Get full text
Journal Article
Conference Proceeding
Anisotropy of Thermal Expansion in an AZ31 Magnesium Alloy Subjected to the Accumulative Roll Bonding
Drozd, Z., Trojanová, Z., Halmešová, K., Džugan, J., Lukáč, P., Minárik, P.
Published in Acta physica Polonica, A (01.09.2018)
Published in Acta physica Polonica, A (01.09.2018)
Get full text
Journal Article
Mechanical properties of Mg alloys composites reinforced with short Saffil ® fibres
Trojanová, Zuzanka, Gärtnerová, Viera, Lukáč, Pavel, Drozd, Zdeněk
Published in Journal of alloys and compounds (22.09.2004)
Published in Journal of alloys and compounds (22.09.2004)
Get full text
Journal Article
Conference Proceeding
New flip-chip assembly system for prototyping and process investigations
Drozd, Z., Hackiewicz, H., Jezior, R., Lasocki, J., Lukasik, W., Orzechowski, J., Szwech, M.
Published in 24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492) (2001)
Published in 24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492) (2001)
Get full text
Conference Proceeding
Thermally activated processes in microcrystalline Mg
Trojanová, Zuzanka, Drozd, Zdenĕk, Lukác̆, Pavel, Máthis, Kristián, Ferkel, Hans, Riehemann, Werner
Published in Scripta materialia (31.05.2000)
Published in Scripta materialia (31.05.2000)
Get full text
Journal Article
Stress relaxation in an AZ91 magnesium alloy
Trojanova, Z, Lukac, P, Gabor, P, Drozd, Z, Mathis, K
Published in Kovove Materialy (Slovak Republic) (01.01.2001)
Get full text
Published in Kovove Materialy (Slovak Republic) (01.01.2001)
Journal Article
Life-time of lead-free soldered SMT joints
Szwech, M., Drozd, Z.
Published in 2008 31st International Spring Seminar on Electronics Technology (01.05.2008)
Published in 2008 31st International Spring Seminar on Electronics Technology (01.05.2008)
Get full text
Conference Proceeding
Mechanical Properties Of Mg-12Li-xAl Alloys Reinforced By Short Saffil Fibres
Trojanova, Z, Kudela, S, Lukac, P, Drozd, Z, Ptacek, L, Mathis, K
Published in Kovove Materialy (01.01.2003)
Get full text
Published in Kovove Materialy (01.01.2003)
Journal Article
Mechanical properties of Mg-Li-Al alloys reinforced by short Saffil fibres
Trojanova, Z, Kudela, S, Lukac, P, Drozd, Z, Mathis, K, Kolenciak, V, Schweighofer, A
Published in Kovove Materialy (Slovak Republic) (01.01.2001)
Get full text
Published in Kovove Materialy (Slovak Republic) (01.01.2001)
Journal Article
Infant mortality failures of lead - free solder joints
Szwech, M., Niedzwiedz, W., Drozd, Z.
Published in 2009 32nd International Spring Seminar on Electronics Technology (01.05.2009)
Published in 2009 32nd International Spring Seminar on Electronics Technology (01.05.2009)
Get full text
Conference Proceeding
Influence of PCBs coatings wettability on lead-free SMT solder joints reliability
Sitek, J., Drozd, Z., Bukat, K.
Published in 2008 31st International Spring Seminar on Electronics Technology (01.05.2008)
Published in 2008 31st International Spring Seminar on Electronics Technology (01.05.2008)
Get full text
Conference Proceeding