A small‐scale creep test for calibrating an efficient lifetime model for high pressure turbine blades
Dresbach, C., Wischek, J., Bartsch, M., Prien, T.
Published in Materialwissenschaft und Werkstofftechnik (01.04.2022)
Published in Materialwissenschaft und Werkstofftechnik (01.04.2022)
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Journal Article
Mechanical properties of glass frit bonded micro packages
DRESBACH, C, KROMBHOLZ, A, EBERT, M, BAGDAHN, J
Published in Microsystem technologies : sensors, actuators, systems integration (01.04.2006)
Published in Microsystem technologies : sensors, actuators, systems integration (01.04.2006)
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Journal Article
Elastic properties of bonding wires
Dresbach, C, Mittag, M, Petzold, M
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Mechanical characterization of gold and copper free air balls in thermosonic wire bond interconnections
Lorenz, G, Petzold, M, Mittag, M, Dresbach, C, Milke, E
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Electron backscatter diffraction microstructure investigations of electronic materials down to the nanoscale
Krause, M, März, B, Dresbach, C, Petzold, M
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Calculation of effective Young's modulus distribution from electron backscatter diffraction results for stochastic analyses in aerospace applications: Berechnung der Verteilung der effektiven elastischen Eigenschaften aus Elektronenrückstreubeugungsuntersuchungen für stochastische Analysen in Luftfahrtanwendungen
Dresbach, C., Dressler, U., Gussone, J., Reh, S.
Published in Materialwissenschaft und Werkstofftechnik (01.05.2014)
Published in Materialwissenschaft und Werkstofftechnik (01.05.2014)
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Journal Article
Mechanical fatigue properties of heavy aluminium wire bonds for power applications
Merkle, L., Kaden, T., Sonner, M., Gademann, A., Turki, J., Dresbach, C., Petzold, M.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Temperature dependent fracture toughness of glass frit bonding layers
Notzold, K., Dresbach, C., Graf, J., Bottge, B.
Published in 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (01.04.2009)
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Published in 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (01.04.2009)
Conference Proceeding
Mechanical properties and microstructure of heavy aluminum bonding wires for power applications
Dresbach, C., Mittag, M., Petzold, M., Milke, E., Muller, T.
Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)
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Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)
Conference Proceeding
Local hardening behavior of free air balls and heat affected zones of thermosonic wire bond interconnections
Dresbach, C., Lorenz, G., Mittag, M., Petzold, M., Milke, E., Muller, T.
Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)
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Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)
Conference Proceeding
Test Methods for Characterizing the Local Plastic Deformability of Bonding Wires
Dresbach, C., Knoll, H., Schischka, J., Petzold, M., Hosseini, K., Schrapler, L.
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
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Conference Proceeding
Fracture mechanical life-time investigation of glass frit-bonded sensors
Petzold, M., Dresbach, C., Ebert, M., Bagdahn, J., Wiemer, M., Glien, K., Graf, J., Muller-Fiedler, R., Hofer, H.
Published in Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006 (2006)
Published in Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006 (2006)
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Conference Proceeding
Microbiological assay of avoparcin in animal feeds and pre-mixes : co-operative study
GLIDDON, M. J, POOLE, C. A, JOHANNSEN, F. H, BUCHER, E, THALMANN, A, DRESBACH, C, ABRAMOWSKI, B
Published in Analyst (London) (1992)
Published in Analyst (London) (1992)
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Journal Article