Investigation of thin films by nanoindentation with doe and numerical methods
Dowhan, L, Wymyslowski, A, Wittler, O
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
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Conference Proceeding
The polymer materials as the essential input parameters in numerical multi-objective optimization of stacked packaging
Dowhan, L., Wymyslowski, A., Felba, J., Dudek, R.
Published in PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (01.08.2008)
Published in PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (01.08.2008)
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Conference Proceeding
Multi-objective Parametric Approach to Numerical Optimization of Stacked Packages
Dowhan, L., Wymyslowski, A., Dudek, R.
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
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Conference Proceeding
Application of genetic algorithm in numerical multi-objective optimization of ceramic capacitors
Dowhan, L., Wymyslowski, A., Felba, J., Wiese, S., Wolter, K.-J.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding