Electroless atomic layer deposition of copper
Venkatraman, Kailash, Joi, Aniruddha, Dordi, Yezdi, Akolkar, Rohan
Published in Electrochemistry communications (01.06.2018)
Published in Electrochemistry communications (01.06.2018)
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Journal Article
Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surface-Limited Redox Replacement of Underpotentially Deposited Zinc
Venkatraman, Kailash, Gusley, Ryan, Yu, Lu, Dordi, Yezdi, Akolkar, Rohan
Published in Journal of the Electrochemical Society (01.01.2016)
Published in Journal of the Electrochemical Society (01.01.2016)
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Journal Article
Electroless Platinum Deposition Using Co3+/Co2+ Redox Couple as a Reducing Agent
Tamasauskaite-Tamasiunaite, Loreta, Dordi, Yezdi, Norkus, Eugenijus, Stankeviciene, Ina, Jagminiene, Aldona, Naujokaitis, Arnas, Tumonis, Liudas, Buzas, Vytenis, Maciulis, Laurynas
Published in Materials (10.04.2021)
Published in Materials (10.04.2021)
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Journal Article
Deposition of Copper on Ruthenium for Cu Metallization
Kelly, James, Van der Straten, O., Vo, Tuan, Janek, Richard, Dordi, Yezdi
Published in ECS transactions (01.10.2010)
Published in ECS transactions (01.10.2010)
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Investigation of RuZn alloy as barrier to Cu interconnect
Wang, Peng, Qu, Xin-Ping, Dordi, Yezdi, Joi, Aniruddha
Published in Journal of materials science. Materials in electronics (01.03.2022)
Published in Journal of materials science. Materials in electronics (01.03.2022)
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Journal Article
Electroless Deposition of Pb Monolayer: A New Process and Application to Surface Selective Atomic Layer Deposition
Wu, Dongjun, Solanki, Dhaivat J, Ramirez, J. Luis, Yang, Wenli, Joi, Aniruddha, Dordi, Yezdi, Dole, Nikhil, Brankovic, Stanko R
Published in Langmuir (25.09.2018)
Published in Langmuir (25.09.2018)
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Journal Article
Electroless Platinum Deposition Using Co 3+ /Co 2+ Redox Couple as a Reducing Agent
Tamasauskaite-Tamasiunaite, Loreta, Dordi, Yezdi, Norkus, Eugenijus, Stankeviciene, Ina, Jagminiene, Aldona, Naujokaitis, Arnas, Tumonis, Liudas, Buzas, Vytenis, Maciulis, Laurynas
Published in Materials (10.04.2021)
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Published in Materials (10.04.2021)
Journal Article
Pulse electrodeposition of copper-manganese alloy in deep eutectic solvent
Chiang, Wei-Shen, Huang, Jun-Qian, Chen, Po-Chun, Wu, Pu-Wei, Joi, Aniruddha, Dordi, Yezdi
Published in Journal of alloys and compounds (25.04.2018)
Published in Journal of alloys and compounds (25.04.2018)
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