Search Results - "Dordi Yezdi" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metallization process on semiconductor wafer

Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metallization process on semiconductor wafer

by DORDI YEZDI, SUGARMAN MICHAEL
Year of Publication 23.07.2002

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Patent

Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer

Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer

by Dordi, Yezdi, Sugarman, Michael
Year of Publication 23.07.2002

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Patent

Methods for atomic layer deposition

Methods for atomic layer deposition

by DORDI YEZDI, KOROLIK MIKHAIL, YOON HYUNGSUK ALEXANDER, REDEKER FRITZ C, BOYD JOHN M
Year of Publication 07.01.2014

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Patent

Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrate

Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrate

by DORDI, YEZDI, PATEL, MEHUL N, HYMES, DIANE, JOI, ANIRUDDHA
Year of Publication 01.08.2017

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Patent

Method and apparatus for wafer electroless plating

Method and apparatus for wafer electroless plating

by WYLIE JACOB, DORDI YEZDI, OWCZARZ ALEKSANDER, ARUNAGIRI TIRUCHIRAPALLI, THOMAS CLINT, SCHOEPP ALAN M, BALISKY TODD, PARKS JOHN, THIE WILLIAM, REDEKER FRITZ C, BOYD JOHN M
Year of Publication 15.03.2016

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Patent

Processes and integrated systems for engineering a substrate surface for metal deposition

Processes and integrated systems for engineering a substrate surface for metal deposition

by DORDI YEZDI, ARUNAGIRI TIRUCHIRAPALLI, YOON HYUNGSUK ALEXANDER, VERTOMMEN JOHAN, HOWALD ARTHUR M, REDEKER FRITZ C, THIE WILLIAM, BOYD JOHN
Year of Publication 14.01.2015

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Patent

Method and apparatus for patching electrochemically deposited layers using electroless deposited materials

Method and apparatus for patching electrochemically deposited layers using electroless deposited materials

by Dordi, Yezdi, Hey, Peter
Year of Publication 18.04.2002

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Patent

Electroplating head and method for operating the same

Electroplating head and method for operating the same

by REDEKER, FRED C, DORDI, YEZDI, BOYD, JOHN, MARASCHIN, BOB
Year of Publication 08.06.2011

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Patent

PERFORATED ANODE FOR UNIFORMLY DEPOSITING METAL LAYER

PERFORATED ANODE FOR UNIFORMLY DEPOSITING METAL LAYER

by DORDI YEZDI N
Year of Publication 25.12.2001

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Patent

Device with post-contact back end of line through-hole via integration

Device with post-contact back end of line through-hole via integration

by DORDI YEZDI, LI SHIJIAN, YOON HYUNGSUK ALEXANDER, REDEKER FRITZ, BOYD JOHN
Year of Publication 27.08.2013

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Patent

Perforated anode for uniform deposition of a metal layer

Perforated anode for uniform deposition of a metal layer

by DORDI, YEZDI N
Year of Publication 04.10.2001

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Patent

HARDWARE DESIGN, SYSTEM CONSTITUTION AND PROCESSING PROCEDURE FOR IMPROVING PRODUCTIVITY OF SEED LAYER AND ACHIEVING EDGE EXPULSION OF 3 MM FOR COPPER COVERING TREATMENT OF SEMICONDUCTOR WAFER

HARDWARE DESIGN, SYSTEM CONSTITUTION AND PROCESSING PROCEDURE FOR IMPROVING PRODUCTIVITY OF SEED LAYER AND ACHIEVING EDGE EXPULSION OF 3 MM FOR COPPER COVERING TREATMENT OF SEMICONDUCTOR WAFER

by DORDI YEZDI, SUGARMAN MICHAEL
Year of Publication 04.09.2001

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Patent

Method and apparatus for material deposition

Method and apparatus for material deposition

by DORDI YEZDI, MARASCHIN BOB, THIE WILLIAM, REDEKER FRED C, BOYD JOHN, COOK JOEL M
Year of Publication 23.07.2013

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Patent

Apparatus and method for depositing an electroless solution

Apparatus and method for depositing an electroless solution

by DORDI, YEZDI N, CASTRO
Year of Publication 11.07.2001

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Patent

METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA GAPFILL AND OVERBURDEN REMOVAL

METHODS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT THROUGH HOLE VIA GAPFILL AND OVERBURDEN REMOVAL

by DORDI YEZDI, LI SHIJIAN, YOON HYUNGSUK ALEXANDER, REDEKER FRITZ, BOYD JOHN
Year of Publication 04.07.2013

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Patent

PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRATED PROXIMITY HEAD

PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRATED PROXIMITY HEAD

by WYLIE JACOB, DORDI YEZDI N, MARASCHIN ROBERT, WOODS CARL A
Year of Publication 27.01.2011

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Patent

Electroless Plating Method and Apparatus

Electroless Plating Method and Apparatus

by DORDI YEZDI, THIE WILLIAM, REDEKER FRITZ C, BOYD JOHN M
Year of Publication 20.01.2011

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Patent

Methods and apparatus for forming metal layers on substrates

Methods and apparatus for forming metal layers on substrates

by DORDI, YEZDI, SUGARMAN, MICHAEL
Year of Publication 23.05.2001

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Patent

Electric contact element for electrochemical deposition system

Electric contact element for electrochemical deposition system

by Dordi, Yezdi, Stevens, Joseph
Year of Publication 26.04.2001

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Patent

Electroless plating method and apparatus

Electroless plating method and apparatus

by DORDI YEZDI, THIE WILLIAM, REDEKER FRITZ C, BOYD JOHN M
Year of Publication 09.11.2010

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Patent

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