Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements
Gan, Dongwen, Ho, Paul S., Huang, Rui, Leu, Jihperng, Maiz, Jose, Scherban, Tracey
Published in Journal of applied physics (15.05.2005)
Published in Journal of applied physics (15.05.2005)
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Effect of passivation on stress relaxation in electroplated copper films
Gan, Dongwen, Ho, Paul S., Pang, Yaoyu, Huang, Rui, Leu, Jihperng, Maiz, Jose, Scherban, Tracey
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Published in Journal of materials research (01.06.2006)
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Feasibility of an Ag-alloy film as a thin-film transistor liquid-crystal display source/drain material
JEONG, C. O, ROH, N. S, HO, Paul S, CHO, B. S, KANG, B. J, YANG, H. J, KO, Y. K, LEE, J. G, KIM, S. G, PARK, H. S, KIM, C. W, SAKONG, D. S, SEOK, J. H, CHUNG, K. H, LEE, W. H, DONGWEN GAN
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Published in Journal of electronic materials (01.06.2002)
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Effects of bump metallurgies, underfill material and its cure process on package warpage
Jieping Zhang, Dongwen Gan, Jinlin Wang, Saikumar, Jayaraman, Li-Hsin Chang
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
Isothermal stress relaxation in electroplated Cu films. I. Masstransport measurements
Gan, Dongwen, Ho, Paul S., Huang, Rui, Leu, Jihperng, Maiz, Jose, Scherban, Tracey
Published in Journal of applied physics (13.05.2005)
Published in Journal of applied physics (13.05.2005)
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Journal Article
Effects of passivation layer on stress relaxation in Cu line structures
Dongwen Gan, Sean Yoon, Ho, P.S., Cresta, P., Singh, N., Bower, A.F., Jihperng Leu, Shankar, S.
Published in Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) (2003)
Published in Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) (2003)
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Conference Proceeding
Effects of Passivation Layer on Stress Relaxation and Mass Transport in Electroplated Cu Films
Gan, Dongwen, Ho, Paul S., Huang, Rui, Leu, Jihperng, Maiz, Jose, Scherban, Tracey
Published in AIP conference proceedings (08.12.2004)
Published in AIP conference proceedings (08.12.2004)
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Journal Article