3D NAND Scaling in the next decade
Meyer, Russ, Fukuzumi, Yoshiaki, Dong, Yingda
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)
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Conference Proceeding
Molecular beam epitaxy of low-resistance polycrystalline p-type GaSb
Yingda Dong, Scott, D.W., Yun Wei, Gossard, A.C., Rodwell, M.J.
Published in International Conference onIndium Phosphide and Related Materials, 2003 (2003)
Published in International Conference onIndium Phosphide and Related Materials, 2003 (2003)
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Conference Proceeding
Distributed Cycling in Charge Trap-Based 3D NAND Arrays: Model and Qualification Tests Implications
Nicosia, Gianluca, Righetti, Niccolo, Dong, Yingda
Published in 2023 IEEE International Memory Workshop (IMW) (01.05.2023)
Published in 2023 IEEE International Memory Workshop (IMW) (01.05.2023)
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Conference Proceeding
A 34 MB/s MLC Write Throughput 16 Gb NAND With All Bit Line Architecture on 56 nm Technology
Cernea, R.-A., Long Pham, Moogat, F., Siu Chan, Binh Le, Yan Li, Shouchang Tsao, Tai-Yuan Tseng, Khanh Nguyen, Li, J., Jayson Hu, Jong Hak Yuh, Hsu, C., Fanglin Zhang, Kamei, T., Nasu, H., Kliza, P., Khin Htoo, Lutze, J., Yingda Dong, Higashitani, M., Junnhui Yang, Hung-Szu Lin, Sakhamuri, V., Li, A., Feng Pan, Yadala, S., Taigor, S., Pradhan, K., Lan, J., James Chan, Abe, T., Fukuda, Y., Mukai, H., Kawakami, K., Liang, C., Ip, T., Shu-Fen Chang, Lakshmipathi, J., Huynh, S., Pantelakis, D., Mofidi, M., Quader, K.
Published in IEEE journal of solid-state circuits (01.01.2009)
Published in IEEE journal of solid-state circuits (01.01.2009)
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