Creating Transformative Interdisciplinary Learning Opportunities for College Students
Bass, Michelle, Dompierre, Kerry-Ann B., McAlister, Martha
Published in Journal of transformative education (01.01.2023)
Published in Journal of transformative education (01.01.2023)
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Journal Article
Cyclic mechanical behaviour of Sn3.0Ag0.5Cu alloy under high temperature isothermal ageing
Dompierre, B., Aubin, V., Charkaluk, E., Filho, W.C. Maia, Brizoux, M.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.05.2011)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.05.2011)
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Journal Article
Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy
Dompierre, B., Maia Filho, W.C., Brizoux, M., Aubin, V., Charkaluk, E.
Published in Microelectronics and reliability (01.09.2010)
Published in Microelectronics and reliability (01.09.2010)
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Journal Article
Conference Proceeding
Failure Probability Assessment using co-Kriging Surrogate Models
Lefebvre, J.-P., Dompierre, B., Robert, A., Le Bihan, M., Wyart, E., Sainvitu, C.
Published in Procedia engineering (2015)
Published in Procedia engineering (2015)
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Journal Article
Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies
Dompierre, B., Aubin, V., Charkaluk, E., Maia Filho, W.C., Brizoux, M.
Published in Procedia engineering (01.04.2010)
Published in Procedia engineering (01.04.2010)
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Journal Article
Influence of build-up construction and resin-content on mechanical behavior of printed circuit boards
Maia Filho, W.C., Brizoux, M., Dompierre, B., Guillaume, B.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding
Influence of thermal ageing on long term reliability of SnAgCu solder joints
Dompierre, B., Aubin, V., Charkaluk, E., Maia Filho, W.C., Brizoux, M.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding