ELECTROSTATIC CHUCK ASSEMBLY HAVING A DIELECTRIC FILLER
Doan, Kenny L, Lee, Evans Yip, Shoji, Sergio Fukuda, Cho, Jaeyong, Noorbakhsh, Hamid, Ramaswamy, Kartik, Husain, Anwar, Zhang, Chunlei, Wang, Haitao
Year of Publication 27.02.2020
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Year of Publication 27.02.2020
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Electrostatic chuck assembly having a dielectric filler
Doan, Kenny L, Lee, Evans Yip, Shoji, Sergio Fukuda, Cho, Jaeyong, Noorbakhsh, Hamid, Ramaswamy, Kartik, Husain, Anwar, Zhang, Chunlei, Wang, Haitao
Year of Publication 10.12.2019
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Year of Publication 10.12.2019
Patent
Electrostatic Chuck Assembly Having A Dielectric Filler
Doan, Kenny L, Lee, Evans Yip, Shoji, Sergio Fukuda, Cho, Jaeyong, Noorbakhsh, Hamid, Ramaswamy, Kartik, Husain, Anwar, Zhang, Chunlei, Wang, Haitao
Year of Publication 25.10.2018
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Year of Publication 25.10.2018
Patent
Etching oxide-nitride stacks using C4F6H2
Kim Jong Mun, Ling Li, Huang Yuju, Payyapilly Jairaj, Shimizu Daisuke, Doan Kenny L, Nemani Srinivas D
Year of Publication 29.08.2017
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Year of Publication 29.08.2017
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ETCHING OXIDE-NITRIDE STACKS USING C4F6H2
DOAN KENNY L, NEMANI SRINIVAS D, SHIMIZU DAISUKE, HUANG YUJU, LING LI, PAYYAPILLY JAIRAJ, KIM JONG MUN
Year of Publication 09.04.2015
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Year of Publication 09.04.2015
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Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone
Bera, Kallol, Zhao, Xiaoye, Doan, Kenny L, Gold, Ezra Robert, Brillhart, Paul Lukas, Geoffrion, Bruno, Pu, Bryan, Hoffman, Daniel J
Year of Publication 31.07.2012
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Year of Publication 31.07.2012
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Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone
DOAN KENNY L, BRILLHART PAUL LUKAS, GEOFFRION BRUNO, HOFFMAN DANIEL J, GOLD EZRA ROBERT, ZHAO XIAOYE, BERA KALLOL, PU BRYAN
Year of Publication 31.07.2012
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Year of Publication 31.07.2012
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Apparatus for uniformly etching a dielectric layer
Doan, Kenny L, Kim, Yunsang, Dahimene, Mahmoud, Liu, Jingbao, Pu, Bryan, Shan, Hongqing, Curry, Don
Year of Publication 08.01.2008
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Year of Publication 08.01.2008
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Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content
Bera, Kallol, Zhao, Xiaoye, Doan, Kenny L, Gold, Ezra Robert, Brillhart, Paul Lukas, Geoffrion, Bruno, Pu, Bryan, Hoffman, Daniel J
Year of Publication 02.06.2009
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Year of Publication 02.06.2009
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Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones
Bera, Kallol, Zhao, Xiaoye, Doan, Kenny L, Gold, Ezra Robert, Brillhart, Paul Lukas, Geoffrion, Bruno, Pu, Bryan, Hoffman, Daniel J
Year of Publication 02.06.2009
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Year of Publication 02.06.2009
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