Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias
Djomeni, Larissa, Mourier, Thierry, Minoret, Stéphane, Fadloun, Sabrina, Piallat, Fabien, Burgess, Steve, Price, Andrew, Zhou, Yun, Jones, Christopher, Mathiot, Daniel, Maitrejean, Sylvain
Published in Microelectronic engineering (25.05.2014)
Published in Microelectronic engineering (25.05.2014)
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Journal Article
Conference Proceeding
X-ray μ-Laue diffraction analysis of Cu through-silicon vias: A two-dimensional and three-dimensional study
Sanchez, Dario Ferreira, Laloum, David, Weleguela, Monica Larissa Djomeni, Ulrich, Olivier, Audoit, Guillaume, Grenier, Adeline, Micha, Jean-Sébastien, Robach, Odile, Lorut, Frédéric, Gergaud, Patrice, Bleuet, Pierre
Published in Journal of applied physics (28.10.2014)
Published in Journal of applied physics (28.10.2014)
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Journal Article
In-situ X-ray μLaue diffraction study of copper through-silicon vias
Sanchez, Dario Ferreira, Reboh, Shay, Weleguela, Monica Larissa Djomeni, Micha, Jean-Sébastien, Robach, Odile, Mourier, Thierry, Gergaud, Patrice, Bleuet, Pierre
Published in Microelectronics and reliability (01.01.2016)
Published in Microelectronics and reliability (01.01.2016)
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Journal Article
Analysis of High Aspect Ratio through Silicon via (TSV) Diffusion and Stress Impact Profile during 3D Advanced Integration
Djomeni, Larissa, Mourier, Thierry, Minoret, Stéphane, Fadloun, Sabrina, Barnes, Jean-Paul, Rouchon, Denis, Burgess, Steve, Price, Andrew, Vandroux, Laurent, Mathiot, Daniel
Published in ECS transactions (26.03.2014)
Published in ECS transactions (26.03.2014)
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Journal Article
Analysis of High Aspect Ratio through Silicon via (TSV) Diffusion and Stress Impact Profile during 3D Advanced Integration
Djomeni, Larissa, Mourier, Thierry, Minoret, Stéphane, Fadloun, Sabrina, Barnes, Jean-Paul, Rouchon, Denis, Burgess, Steve, Price, Andrew, Vandroux, Laurent, Mathiot, Daniel
Published in Meeting abstracts (Electrochemical Society) (01.04.2014)
Published in Meeting abstracts (Electrochemical Society) (01.04.2014)
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Journal Article