Experimental evaluation of a single access point bluetooth localisation system
Kelly, D, McLoone, S, Dishongh, T
Published in IET Irish Signals and Systems Conference (ISSC 2008) (2008)
Published in IET Irish Signals and Systems Conference (ISSC 2008) (2008)
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Conference Proceeding
Innovative circuit board level routing designs for BGA packages
Titus, A., Jaiswal, B., Dishongh, T.
Published in IEEE transactions on advanced packaging (01.11.2004)
Published in IEEE transactions on advanced packaging (01.11.2004)
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Journal Article
Thermomechanical behavior of BGA solder joints under vibrations: an experimental observation
Zhao, Y., Basaran, C., Cartwright, A., Dishongh, T.
Published in ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) (2000)
Published in ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) (2000)
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Conference Proceeding
Impact of temperature cycle profile on fatigue life of solder joints
Dishongh, T., Basaran, C., Cartwright, A.N., Ying Zhao, Heng Liu
Published in IEEE transactions on advanced packaging (01.08.2002)
Published in IEEE transactions on advanced packaging (01.08.2002)
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Journal Article
Thermomechanical analysis in electronic packaging with unified constitutive model for materials and joints
Desai, C.S., Basaran, C., Dishongh, T., Prince, J.L.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1998)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1998)
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Journal Article
Flow network modeling for improving flow distribution of microelectronics burn-in oven
Bin Lian, Dishongh, T., Pullen, D., Hongfei Yan, Jing Chen
Published in ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) (2000)
Published in ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) (2000)
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Conference Proceeding
Reliability of stack packaging varying the die stacking architectures for flash memory applications
Hossain, M.M., Yongje Lee, Akhter, R., Agonafer, D., Pekin, S., Dishongh, T.
Published in Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium (2006)
Published in Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium (2006)
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Conference Proceeding
Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation
Zhao, Y., Basaran, C., Cartwright, A., Dishongh, T.
Published in Journal of mechanical behaviour of materials (01.06.1999)
Published in Journal of mechanical behaviour of materials (01.06.1999)
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Journal Article
A Bluetooth-based minimum infrastructure home localisation system
Kelly, D., McLoone, S., Dishongh, T.
Published in 2008 IEEE International Symposium on Wireless Communication Systems (01.10.2008)
Published in 2008 IEEE International Symposium on Wireless Communication Systems (01.10.2008)
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Conference Proceeding
Evaluation of Bluetooth Communications for the Deployment of Assisted Living Technologies in Home Environments
McGrath, M.J., Burns, A., Dishongh, T.
Published in 2007 29th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (01.01.2007)
Published in 2007 29th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (01.01.2007)
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Conference Proceeding
Journal Article
Single Access Point Location Tracking for In-Home Health Monitoring
Kelly, D., McLoone, S., Dishongh, T., McGrath, M., Behan, J.
Published in 2008 5th Workshop on Positioning, Navigation and Communication (01.03.2008)
Published in 2008 5th Workshop on Positioning, Navigation and Communication (01.03.2008)
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Conference Proceeding