by Hu, C., Martin, S., Dingreville, R.
Published in Computer methods in applied mechanics and engineering (01.07.2022)

by Cusentino, M. A., Wood, M. A., Dingreville, R.
Published in Journal of applied physics (28.09.2020)

by Dingreville, Rémi, Qu, Jianmin, Mohammed Cherkaoui
Published in Journal of the mechanics and physics of solids (01.08.2005)

by Zhou, X. W, Dingreville, R, Karnesky, R. A
Published in Physical chemistry chemical physics : PCCP (20.12.2017)

by Dingreville, R., Qu, J.
Published in Acta materialia (2007)

by Dingreville, R., Qu, J.
Published in Computational materials science (01.07.2009)

by Tsao, J.Y., Abbott, R.G., Crowder, D.C., Desai, S., Dingreville, R.P.M., Fowler, J.E., Garland, A., Iyer, P.P., Murdock, J., Steinmetz, S.T., Yarritu, K.A., Johnson, C.M., Stracuzzi, D.J.
Published in Journal of creativity (01.08.2024)

by Kalaswad, M., Custer, J. O., Addamane, S., Khan, R. M., Jauregui, L., Babuska, T. F., Henriksen, A., DelRio, F. W., Dingreville, R., Boyce, B. L., Adams, D. P.
Published in Integrating materials and manufacturing innovation (01.06.2023)

by Muntifering, B., Juan, P.-A., Dingreville, R., Qu, J., Hattar, K.
Published in Microscopy and microanalysis (01.07.2016)

by Muntifering, B., Dunn, A., Dingreville, R., Qu, J., Hattar, K.
Published in Microscopy and microanalysis (01.08.2015)

by Kounouho, S., Dingreville, R., Guilleminot, J.
Published in Computer methods in applied mechanics and engineering (01.11.2024)

by Monti, J.M., Hopkins, E.M., Hattar, K., Abdeljawad, F., Boyce, B.L., Dingreville, R.
Published in Acta materialia (01.03.2022)

by Fernandez, M.E., Dingreville, R., Medlin, D.L., Spearot, D.E.
Published in Acta materialia (01.05.2024)

by Dingreville, Rémi, Karnesky, Richard A, Puel, Guillaume, Schmitt, Jean-Hubert
Published in Journal of materials science (01.02.2016)

by Dingreville, Rémi, Karnesky, Richard A., Puel, Guillaume, Schmitt, Jean-Hubert
Published in Journal of materials science (01.02.2016)

by Dingreville, R., Jiamnin Qu, Cherkaoui, M.
Published in 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings (2004)

by Jianmin Qu, Dingreville, R.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)

by Dingreville, R., Jianmin Qu
Published in 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface (2006)