Design and Optimization of a Stationary Electrode in a Vertically-Driven MEMS Inertial Switch for Extending Contact Duration
Xu, Qiu, Yang, Zhuo-Qing, Fu, Bo, Bao, Yan-Ping, Wu, Hao, Sun, Yun-Na, Zhao, Meng-Yuan, Li, Jian, Ding, Gui-Fu, Zhao, Xiao-Lin
Published in Sensors (Basel, Switzerland) (07.03.2017)
Published in Sensors (Basel, Switzerland) (07.03.2017)
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Journal Article
Electroplating of low stress permalloy for MEMS
Zhang, Yong-hua, Ding, Gui-fu, Cai, Yu-li, Wang, Hong, Cai, Bingchu
Published in Materials characterization (01.08.2006)
Published in Materials characterization (01.08.2006)
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Journal Article
A fast switching bistable electromagnetic microactuator fabricated by UV-LIGA technology
Zhang, Yong-hua, Ding, Gui-fu, Fu, Shi, Cai, Bing-chu
Published in Mechatronics (Oxford) (01.03.2007)
Published in Mechatronics (Oxford) (01.03.2007)
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Journal Article
Modeling, microfabrication and experiments of a free–free cantilever bistable micro mechanism supported with a diamond configuration
Wu, Yi-Bo, Wang, Juang, Yan, Chun-Ping, Mao, Sheng-Ping, Zhang, Cong-Chun, Wang, Hong, Ding, Gui-Fu
Published in Microsystem technologies : sensors, actuators, systems integration (01.11.2010)
Published in Microsystem technologies : sensors, actuators, systems integration (01.11.2010)
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Journal Article
Fabrication and piezoresistance of high temperature ITO thin film strain gauge
Yang, Shen-yong, Zhang, Cong-chun, Yang, Zhuo-qing, Li, Hong-fang, Yao, Jin-yuan, Huang, Man-guo, Wang, Hong, Ding, Gui-fu
Published in Cai liao gong cheng = Journal of materials engineering (01.04.2020)
Published in Cai liao gong cheng = Journal of materials engineering (01.04.2020)
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Journal Article
Measurement of Young's modulus and residual stress of copper film electroplated on silicon wafer
Zhou, Yong, Yang, Chun-Sheng, Chen, Ji-An, Ding, Gui-Fu, Ding, Wen, Wang, Li, Wang, Ming-Jun, Zhang, Ya-Ming, Zhang, Tai-Hua
Published in Thin solid films (22.07.2004)
Published in Thin solid films (22.07.2004)
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Journal Article
Fabrication and Properties of Patterned Nichrome Thin Film Using MEMs Technology
Zhang, Cong Chun, Cheng, Ping, Ding, Gui Fu, Han, Jie
Published in Applied Mechanics and Materials (01.03.2014)
Published in Applied Mechanics and Materials (01.03.2014)
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Journal Article
Analysis of electrochemical degradation of coking wastewater using multiwall carbon nanotubes modified electrode
Shu-Jing Sun, Yan Wang, Hong Wang, Gui-Fu Ding
Published in International Conference on Advanced Technology of Design and Manufacture (ATDM 2010) (2010)
Published in International Conference on Advanced Technology of Design and Manufacture (ATDM 2010) (2010)
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Conference Proceeding
Micro machining of micro-cantilever probes for efficient deposition for biochips
Li, Yong-Hai, Ding, Gui-Fu, Xu, Jun-Tao, Zhang, Yong-Hua
Published in Shengwu gongcheng xuebao (01.03.2005)
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Published in Shengwu gongcheng xuebao (01.03.2005)
Journal Article
Electrodepositing amorphous Ni-W alloys for MEMS
Wang, Hong, Liu, Rui, Cheng, FengJi, Cao, Ying, Ding, GuiFu, Zhao, XiaoLin
Published in Microelectronic engineering (01.10.2010)
Published in Microelectronic engineering (01.10.2010)
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Journal Article
A Novel Method to Fabricate High Aspect Ratio Microcoils
Gu, Wen Jun, Sun, Shi, Dai, Xu Han, Ding, Gui Fu
Published in Applied Mechanics and Materials (01.03.2014)
Published in Applied Mechanics and Materials (01.03.2014)
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Journal Article
Barrier and Seed Layers Deposition in TSV Using Magnetron Sputtering
Zhang, Cong Chun, Wang, Rui Dong, Ding, Gui Fu, Gao, Yang
Published in Applied Mechanics and Materials (01.03.2014)
Published in Applied Mechanics and Materials (01.03.2014)
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Journal Article