Dynamic Compact Thermal Model for stacked-die components
Monier-Vinard, E., Dia, C. T., Bissuel, V., Laraqi, N., Daniel, O.
Published in 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2012)
Published in 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2012)
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Conference Proceeding
Thermal modeling of active embedded chip into high density electronic board
Dia, C. T., Monier-Vinard, E., Bissuel, V., Daniel, O.
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)
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Conference Proceeding
Extension of the DELPHI methodology to Dynamic Compact Thermal Model of electronic component
Monier-Vinard, E., Dia, C. T., Bissuel, V., Daniel, O., Laraqi, N.
Published in 2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2011)
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Published in 2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2011)
Conference Proceeding
Molecular evolution of human immunodeficiency virus type 1 subtype A in Senegal: 1988-1997
Sankalé, J L, Hamel, D, Woolsey, A, Traoré, T, Dia, T C, Guèye-Ndiaye, A, Essex, M, Mboup, T, Kanki, P
Published in Journal of human virology (01.05.2000)
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Published in Journal of human virology (01.05.2000)
Journal Article