Numerical investigation of an evaporating meniscus in a channel
Dhavaleswarapu, Hemanth K., Murthy, Jayathi Y., Garimella, Suresh V.
Published in International journal of heat and mass transfer (31.01.2012)
Published in International journal of heat and mass transfer (31.01.2012)
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Journal Article
Experimental Investigation of Evaporation from Low-Contact-Angle Sessile Droplets
Dhavaleswarapu, Hemanth K, Migliaccio, Christopher P, Garimella, Suresh V, Murthy, Jayathi Y
Published in Langmuir (19.01.2010)
Published in Langmuir (19.01.2010)
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Journal Article
Visualization of convection patterns near an evaporating meniscus using ?PIV
Chamarthy, Pramod, Dhavaleswarapu, Hemanth K, Garimella, Suresh V, Murthy, Jayathi Y, Wereley, Steven T
Published in Experiments in fluids (01.03.2008)
Published in Experiments in fluids (01.03.2008)
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Journal Article
Visualization of convection patterns near an evaporating meniscus using μPIV: Selected papers from the 12th International Symposium on Flow Visualization
CHAMARTHY, Pramod, DHAVALESWARAPU, Hemanth K, GARIMELLA, Suresh V, MURTHY, Jayathi Y, WERELEY, Steven T
Published in Experiments in fluids (2008)
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Published in Experiments in fluids (2008)
Journal Article
Standoff spacers for managing bondline thickness in microelectronic packages
Deshmukh, Sachin, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R
Year of Publication 05.05.2020
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Year of Publication 05.05.2020
Patent
Multiple-chip package with multiple thermal interface materials
Liu, Boxi, Matayabas, Jr., James C, Jain, Syadwad, Dhavaleswarapu, Hemanth K
Year of Publication 03.03.2020
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Year of Publication 03.03.2020
Patent
MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS
MATAYABAS, James C., Jr, LIU, Boxi, DHAVALESWARAPU, Hemanth K, JAIN, Syadwad
Year of Publication 11.09.2019
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Year of Publication 11.09.2019
Patent
MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS
LIU, Boxi, MATAYABAS, Jr., James C, DHAVALESWARAPU, Hemanth K, JAIN, Syadwad
Year of Publication 27.12.2018
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Year of Publication 27.12.2018
Patent