Experimental observation of induced-charge electro-osmosis around a metal wire in a microchannel
Levitan, Jeremy A., Devasenathipathy, Shankar, Studer, Vincent, Ben, Yuxing, Thorsen, Todd, Squires, Todd M., Bazant, Martin Z.
Published in Colloids and surfaces. A, Physicochemical and engineering aspects (05.10.2005)
Published in Colloids and surfaces. A, Physicochemical and engineering aspects (05.10.2005)
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Journal Article
Conference Proceeding
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
BERTRAND WESTON, WAN ZHIMIN, DEVASENATHIPATHY SHANKAR, ARRINGTON KYLE, MCCANN AARON, NEAL NICHOLAS
Year of Publication 27.08.2021
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Year of Publication 27.08.2021
Patent
Particle Tracking Techniques for Electrokinetic Microchannel Flows
Devasenathipathy, Shankar, Santiago, Juan G, Takehara, Kohsei
Published in Analytical chemistry (Washington) (01.08.2002)
Published in Analytical chemistry (Washington) (01.08.2002)
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Journal Article
VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR
Devasenathipathy, Shankar, Patankar, Gaurav, Valavala, Krishna Vasanth
Year of Publication 14.09.2023
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Year of Publication 14.09.2023
Patent
Cooling solution including microchannel arrays and methods of forming the same
Wan, Zhimin, Devasenathipathy, Shankar, Chang, Je-Young, Neal, Nicholas
Year of Publication 13.02.2024
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Year of Publication 13.02.2024
Patent
A hybrid method for bubble geometry reconstruction in two-phase microchannels
WANG, Evelyn N, DEVASENATHIPATHY, Shankar, HAO LIN, HIDROVO, Carlos H, SANTIAGO, Juan G, GOODSON, Kenneth E, KENNY, Thomas W
Published in Experiments in fluids (01.06.2006)
Published in Experiments in fluids (01.06.2006)
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Journal Article
Socket loading mechanism for passive or active socket and package cooling
Wan, Zhimin, Devasenathipathy, Shankar, Chiu, Chia-Pin, Klein, Steven A
Year of Publication 09.05.2023
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Year of Publication 09.05.2023
Patent
Integrated circuit package socket housing to enhance package cooling
Wan, Zhimin, Devasenathipathy, Shankar, Chiu, Chia-Pin, Klein, Steven A
Year of Publication 14.02.2023
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Year of Publication 14.02.2023
Patent
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
BERTRAND, Weston, ARRINGTON, Kyle, MCCANN, Aaron, DEVASENATHIPATHY, Shankar, NEAL, Nicholas, WAN, Zhimin
Year of Publication 22.08.2024
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Year of Publication 22.08.2024
Patent
Enhanced base die heat path using through-silicon vias
McCann, Aaron, Wan, Zhimin, Devasenathipathy, Shankar, Bertrand, Weston, Arrington, Kyle, Neal, Nicholas
Year of Publication 06.08.2024
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Year of Publication 06.08.2024
Patent
Printed heat spreader structures and methods of providing same
Devasenathipathy, Shankar, Reyes Schuldes, Jesus Gerardo, Malatkar, Pramod, Antoniswamy, Aravindha, Arrington, Kyle
Year of Publication 05.03.2024
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Year of Publication 05.03.2024
Patent
Enhanced base die heat path using through-silicon vias
McCann, Aaron, Wan, Zhimin, Devasenathipathy, Shankar, Bertrand, Weston, Arrington, Kyle, Neal, Nicholas
Year of Publication 26.12.2023
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Year of Publication 26.12.2023
Patent
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
BERTRAND, Weston, ARRINGTON, Kyle, MCCANN, Aaron, DEVASENATHIPATHY, Shankar, NEAL, Nicholas, WAN, Zhimin
Year of Publication 27.04.2023
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Year of Publication 27.04.2023
Patent