Contactless pre-bond TSV fault diagnosis using duty-cycle detectors and ring oscillators
Deutsch, Sergej, Chakrabarty, Krishnendu
Published in 2015 IEEE International Test Conference (ITC) (01.10.2015)
Published in 2015 IEEE International Test Conference (ITC) (01.10.2015)
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Conference Proceeding
The hype, myths, and realities of testing 3D integrated circuits
Ran Wang, Deutsch, Sergej, Agrawal, Mukesh, Chakrabarty, Krishnendu
Published in 2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (07.11.2016)
Published in 2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (07.11.2016)
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Conference Proceeding
DfT architecture and ATPG for Interconnect tests of JEDEC Wide-I/O memory-on-logic die stacks
Deutsch, S., Keller, B., Chickermane, V., Mukherjee, S., Sood, N., Goel, S. K., Chen, J., Mehta, A., Lee, F., Marinissen, E. J.
Published in 2012 IEEE International Test Conference (01.11.2012)
Published in 2012 IEEE International Test Conference (01.11.2012)
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Conference Proceeding
Security definitions, entropy measures and constructions for implicitly detecting data corruption
Kounavis, Michael, Durham, David, Deutsch, Sergej, Grewal, Ken
Published in Computer communications (01.07.2020)
Published in Computer communications (01.07.2020)
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Journal Article
K-Cipher: A Low Latency, Bit Length Parameterizable Cipher
Kounavis, Michael, Deutsch, Sergej, Ghosh, Santosh, Durham, David
Published in 2020 IEEE Symposium on Computers and Communications (ISCC) (01.07.2020)
Published in 2020 IEEE Symposium on Computers and Communications (ISCC) (01.07.2020)
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Conference Proceeding
Massive signal tracing using on-chip DRAM for in-system silicon debug
Deutsch, Sergej, Chakrabarty, Krishnendu
Published in 2014 International Test Conference (01.10.2014)
Published in 2014 International Test Conference (01.10.2014)
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Conference Proceeding
IVP: A Three Level Confusion-Diffusion Network Supporting Implicit Data Integrity
Kounavis, Michael, Durham, David, Deutsch, Sergej, Grewal, Ken
Published in 2019 IEEE Symposium on Computers and Communications (ISCC) (01.06.2019)
Published in 2019 IEEE Symposium on Computers and Communications (ISCC) (01.06.2019)
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Conference Proceeding
Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels
Deutsch, Sergej, Chakrabarty, Krishnendu
Published in 2013 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2013)
Published in 2013 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2013)
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Conference Proceeding
Test and Design-for-Testability Solutions for 3D Integrated Circuits
Chakrabarty, Krishnendu, Agrawal, Mukesh, Deutsch, Sergej, Noia, Brandon, Wang, Ran, Ye, Fangming
Published in Information and Media Technologies (01.01.2014)
Published in Information and Media Technologies (01.01.2014)
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Journal Article
Test and debug solutions for 3D-stacked integrated circuits
Deutsch, Sergej, Chakrabarty, Krishnendu
Published in 2015 IEEE International Test Conference (ITC) (01.10.2015)
Published in 2015 IEEE International Test Conference (ITC) (01.10.2015)
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Conference Proceeding
TSV defects and TSV-induced circuit failures: The third dimension in test and design-for-test
Chakrabarty, K., Deutsch, S., Thapliyal, H., Fangming Ye
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
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Conference Proceeding
Uncertainty-aware robust optimization of test-access architectures for 3D stacked ICs
Deutsch, Sergej, Chakrabarty, Krishnendu, Marinissen, Erik Jan
Published in 2013 IEEE International Test Conference (ITC) (01.09.2013)
Published in 2013 IEEE International Test Conference (ITC) (01.09.2013)
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Conference Proceeding
Vesuvius-3D: A 3D-DfT demonstrator
Marinissen, Erik Jan, De Wachter, Bart, O'Loughlin, Stephen, Deutsch, Sergej, Papameletis, Christos, Burgherr, Tobias
Published in 2014 International Test Conference (01.10.2014)
Published in 2014 International Test Conference (01.10.2014)
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Conference Proceeding
TSV Stress-Aware ATPG for 3D Stacked ICs
Deutsch, S., Chakrabarty, K., Panth, S., Sung Kyu Lim
Published in 2012 IEEE 21st Asian Test Symposium (01.11.2012)
Published in 2012 IEEE 21st Asian Test Symposium (01.11.2012)
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Conference Proceeding