Interface fracture properties of thin films studied by using the micro-cantilever deflection technique
Matoy, Kurt, Detzel, Thomas, Müller, Matthias, Motz, Christian, Dehm, Gerhard
Published in Surface & coatings technology (25.12.2009)
Published in Surface & coatings technology (25.12.2009)
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Journal Article
Conference Proceeding
Fast System to measure the dynamic on-resistance of on-wafer 600 V normally off GaN HEMTs in hard-switching application conditions
Barbato, Alessandro, Barbato, Marco, Meneghini, Matteo, Silvestri, Marco, Detzel, Thomas, Haeberlen, Oliver, Spiazzi, Giorgio, Meneghesso, Gaudenzio, Zanoni, Enrico
Published in IET power electronics (19.08.2020)
Published in IET power electronics (19.08.2020)
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Journal Article
Micron-sized fracture experiments on amorphous SiOx films and SiOx/SiNx multi-layers
Matoy, Kurt, Schönherr, Helmut, Detzel, Thomas, Dehm, Gerhard
Published in Thin solid films (02.08.2010)
Published in Thin solid films (02.08.2010)
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Journal Article
On the temperature dependence of Na migration in thin SiO 2 films during ToF-SIMS O 2 + depth profiling
Krivec, Stefan, Detzel, Thomas, Buchmayr, Michael, Hutter, Herbert
Published in Applied surface science (15.10.2010)
Published in Applied surface science (15.10.2010)
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Journal Article
On the temperature dependence of Na migration in thin SiO2 films during ToF-SIMS O2+ depth profiling
Krivec, Stefan, Detzel, Thomas, Buchmayr, Michael, Hutter, Herbert
Published in Applied surface science (01.10.2010)
Published in Applied surface science (01.10.2010)
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Journal Article
The effect of bias-temperature stress on Na+ incorporation into thin insulating films : Applied Surface Analysis
KRIVEC, Stefan, BUCHMAYR, Michael, DETZEL, Thomas, FROEMLING, Till, FLEIG, Juergen, HUTTER, Herbert
Published in Analytical and bioanalytical chemistry (2011)
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Published in Analytical and bioanalytical chemistry (2011)
Journal Article
Modeling of stress evolution of electroplated Cu films during self-annealing
Rui Huang, Robl, Werner, Detzel, Thomas, Ceric, Hajdin
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
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Conference Proceeding
Thermomechanical Stresses in Copper Films at Elevated Temperature
LEDERER, Martin, ZARBAKHSH, Javad, RUI HUANG, DETZEL, Thomas, WEISS, Brigitte
Published in Journal of microelectronics and electronic packaging (01.04.2010)
Published in Journal of microelectronics and electronic packaging (01.04.2010)
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Journal Article
The Commercialization of GaN Power Devices: Value Proposition, Manufacturing, and Reliability
Detzel, Thomas, Charles, Alain, Deboy, Gerald, Haeberlen, Oliver, McDonald, Timothy
Published in 2019 Compound Semiconductor Week (CSW) (01.05.2019)
Published in 2019 Compound Semiconductor Week (CSW) (01.05.2019)
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Conference Proceeding