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Comparative study of interfacial reactions of Sn-Ag-Cu and Sn-Ag solders on Cu pads during reflow soldering
by
Sharif, Ahmed
,
Chan, Y. C.
Published in
Journal of electronic materials
(01.01.2005)
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Journal Article
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engineering
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physics
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comparative studies
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condensed matter physics
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condensed matter: structure, mechanical and thermal properties
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copper
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cu substrate
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dissolution
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English
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ProQuest Technology Collection
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