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Hierarchical placement and floorplanning in BEAR
Dai, W.W.-M.
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.12.1989)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.12.1989)
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Molecular simulator: A basic tool for submicron M.O.S. Process development
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IPMs solving major reliability issues in automotive applications [intelligent power module]
HUSSEIN, K. H, MAJUMDAR, G, YOSHIDA, S, MAEKAWA, H
Published in 2004 proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs : 24-27 May 2004 (2004)
Published in 2004 proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs : 24-27 May 2004 (2004)
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The solder joint characterization in green WLCSP
Lee, J.C.B., Jun-Yuan Chen, Pel Chun Chen, Li, S.W.
Published in 2004 54th Electronic Components and Technology Conference (2004)
Published in 2004 54th Electronic Components and Technology Conference (2004)
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Results of comparative reliability tests on lead-free solder alloys
Grossmann, G., Nicoletti, G., Soler, U.
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
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A new software tool to model measured RF-data with optimum circuit topology
SIDDIK YARMAN, B, KILINC, Ali, AKSEN, Ahmet
Published in 2004 IEEE International Symposium on Circuits and Systems (2004)
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Published in 2004 IEEE International Symposium on Circuits and Systems (2004)
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Chip-package codesign of integrated voltage-controlled oscillator in LCP substrate
Bavisi, A., Dalmia, S., Swaminathan, M., White, G., Sundaram, V.
Published in IEEE transactions on advanced packaging (01.08.2006)
Published in IEEE transactions on advanced packaging (01.08.2006)
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Considerations for using low dielectric constant material as re-passivation layer on 300mm wafer bump process and manufacturing benefits of flip chip package
Yu, R., Tai, T., Hsieh, A., Cheng, A., Tseng, I., Tsai, M., Homing Tong, Lee, J.J.
Published in IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) (2004)
Published in IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) (2004)
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Reliability assessment of a high CTE CBGA for high availability systems
Teng, S.Y., Brillhart, M.
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
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Opportunities and challenges in asymmetric device implementation [CMOS device scaling]
Buller, J.F., vanBentum, R., Cheek, J., Ehrichs, E., Horstmann, M., Searles, S.
Published in 2004 IEEE Custom Integrated Circuits Conference (2004)
Published in 2004 IEEE Custom Integrated Circuits Conference (2004)
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A Markov chain sequence generator for power macromodeling
Liu, Xun, Papaefthymiou, Marios C.
Published in Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design (10.11.2002)
Published in Digest of technical papers - IEEE/ACM International Conference on Computer-Aided Design (10.11.2002)
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