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Materials and device structures for sub-32 nm CMOS nodes
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Characterization of STI Edge Effects on CMOS Variability
Wils, N., Tuinhout, H.P., Meijer, M.
Published in IEEE transactions on semiconductor manufacturing (01.02.2009)
Published in IEEE transactions on semiconductor manufacturing (01.02.2009)
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Efficient post-configuration testing of an asynchronous nanowire crossbar system for reliability
Lee, J.-S., Venkateswaran, S., Choi, M.
Published in IET computers & digital techniques (01.07.2012)
Published in IET computers & digital techniques (01.07.2012)
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Porous Ceramic Packaging for a MEMS Humidity Sensor Requiring Environmental Access
Dean, R N, Surgnier, S, Pack, J, Sanders, N, Reiner, P, Long, C W, Fenner, R, Fenner, W P
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
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Current Leads and Optimized Thermal Packaging for Superconducting Systems on Multistage Cryocoolers
Kadin, A.M., Webber, R.J., Gupta, D.
Published in IEEE transactions on applied superconductivity (01.06.2007)
Published in IEEE transactions on applied superconductivity (01.06.2007)
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Influence of Inlet Configurations on the Refrigerant Distribution of a Dual Cold-Plate System
Yang, Kai-Shing, Yu, Kun-Huang, Chen, Ing-Youn, Wang, Chi-Chuan
Published in Heat transfer engineering (01.07.2010)
Published in Heat transfer engineering (01.07.2010)
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A High-Density 45 nm SRAM Using Small-Signal Non-Strobed Regenerative Sensing
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Simulation of transient thermal states in layered electronic microstructures
Kalita, Włodzimierz, Klepacki, Dariusz, Węglarski, Mariusz
Published in Microelectronics and reliability (01.07.2008)
Published in Microelectronics and reliability (01.07.2008)
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Analytical Models for the Performance of von Neumann Multiplexing
Roelke, G., Baldwin, R., Bulutoglu, D.
Published in IEEE transactions on nanotechnology (01.01.2007)
Published in IEEE transactions on nanotechnology (01.01.2007)
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