Kinetic model of thermal degradation of polymers for nonisothermal process
Denq, Bar-Long, Chiu, Wen-Yen, Lin, King-Fu
Published in Journal of applied polymer science (05.12.1997)
Published in Journal of applied polymer science (05.12.1997)
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Journal Article
Thermal degradation behavior of epoxy resin blended with propyl ester phosphazene
Denq, Bar-Long, Chiu, Wen-Yen, Lin, King-Fu, Fuh, Ming-Ren Steve
Published in Journal of applied polymer science (01.08.2001)
Published in Journal of applied polymer science (01.08.2001)
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Journal Article
Technical review of characterization methods for thermal interface Materials (TIM)
Goel, N., Anoop, T.K., Bhattacharya, A., Cervantes, J.A., Mongia, R.K., Machiroutu, S.V., Hau-Lan Lin, Ya-Chi Huang, Kuang-Cheng Fan, Bar-Long Denq, Chen-Hua Liu, Chun-Hung Lin, Chi-Wei Tien, Pan, J.-H.
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
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Conference Proceeding
Thermal degradation behavior and flammability of polyurethanes blended with poly(bispropoxyphosphazene)
WANG, P.-S, CHIU, W.-Y, CHEN, L.-W, DENQ, B.-L, DON, T.-M, CHIU, Y.-S
Published in Polymer degradation and stability (01.12.1999)
Published in Polymer degradation and stability (01.12.1999)
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Journal Article
Thermal degradation behavior of polystyrene blended with propyl ester phosphazene
Denq, Bar-long, Chiu, Wen-yen, Chen, Leo-wang, Lee, Ching-yuan
Published in Polymer degradation and stability (01.01.1997)
Published in Polymer degradation and stability (01.01.1997)
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Journal Article
Technical Review of Characterization Methods for Thermal Interface Materials (TIM)
Goel, N., Bhattacharya, A., Cervantes, J.A., Mongia, R.K., Machiroutu, S.V., Hau-Lan Lin, Ya-Chi Huang, Kuang-Cheng Fan, Bar-Long Denq, Chen-Hua Liu, Chun-Hung Lin, Chi-Wei Tien, Jenq-Haur Pan
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Cover and electronic device having the same
Li, Chun-Ping, Mao, Tsai-Wen, Denq, Bar-Long, Tzou, Jyh-Chyang, Chu, Yuan-Ping
Year of Publication 09.04.2019
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Year of Publication 09.04.2019
Patent
COVER AND ELECTRONIC DEVICE HAVING THE SAME
Li, Chun-Ping, Mao, Tsai-Wen, Denq, Bar-Long, Tzou, Jyh-Chyang, Chu, Yuan-Ping
Year of Publication 13.09.2018
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Year of Publication 13.09.2018
Patent
Elastic cover and electronic apparatus
Chu Yuan-Ping, Mao Tsai-Wen, Tzou Jyh-Chyang, Denq Bar-Long, Li Chun-Ping
Year of Publication 06.02.2018
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Year of Publication 06.02.2018
Patent
ELASTIC COVER AND ELECTRONIC APPARATUS
Chu Yuan-Ping, Mao Tsai-Wen, Tzou Jyh-Chyang, Denq Bar-Long, Li Chun-Ping
Year of Publication 19.10.2017
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Year of Publication 19.10.2017
Patent