Wettability control of polymeric microstructures replicated from laser-patterned stamps
Fu, Yangxi, Soldera, Marcos, Wang, Wei, Milles, Stephan, Deng, Kangfa, Voisiat, Bogdan, Nielsch, Kornelius, Lasagni, Andrés Fabián
Published in Scientific reports (30.12.2020)
Published in Scientific reports (30.12.2020)
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Journal Article
Inertial micro-switch capable of prolonging contact time
Deng, Kangfa, Su, Weiguo, Li, Song, Zhang, Yating, Zhang, Wei
Published in Electronics letters (29.08.2013)
Published in Electronics letters (29.08.2013)
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Journal Article
Design, simulation and characterization of hydrogel-based thermal actuators
Deng, Kangfa, Rohn, Mathias, Gerlach, Gerald
Published in Sensors and actuators. B, Chemical (29.11.2016)
Published in Sensors and actuators. B, Chemical (29.11.2016)
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Journal Article
Miniaturized force-compensated hydrogel-based pH sensors
Deng, Kangfa, Bellmann, Christian, Fu, Yangxi, Rohn, Mathias, Guenther, Margarita, Gerlach, Gerald
Published in Sensors and actuators. B, Chemical (01.02.2018)
Published in Sensors and actuators. B, Chemical (01.02.2018)
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Journal Article
Geometric Study of Polymer Embedded Micro Thermoelectric Cooler with Optimized Contact Resistance
Dutt, Aditya S., Deng, Kangfa, Li, Guodong, Pulumati, Nithin B, Ramos, David Alberto Lara, Barati, Vida, Garcia, Javier, Perez, Nicolas, Nielsch, Kornelius, Schierning, Gabi, Reith, Heiko
Published in Advanced electronic materials (01.07.2022)
Published in Advanced electronic materials (01.07.2022)
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Journal Article
Inertial micro-switch capable of prolonging contact time
Deng, Kangfa, Su, Weiguo, Li, Song, Zhang, Yating, Zhang, Wei
Published in Electronics letters (29.08.2013)
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Published in Electronics letters (29.08.2013)
Journal Article
Control of a Hydrogel-based Thermal Actuator in Closed-loop Configuration
Deng, Kangfa, Mu, Guorui, Guenther, Margarita, Gerlach, Gerald
Published in Procedia engineering (2016)
Published in Procedia engineering (2016)
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Journal Article
A convenient wafer level bonding based on unpatterned BCB
Lei Li, Kangfa Deng, Wen Xia, Ningli Zhu, Song Li, Weiguo Su, Wei Zhang
Published in The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) (01.04.2014)
Published in The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) (01.04.2014)
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Conference Proceeding
Thermal Microactuator Based on Temperature-sensitive Hydrogel
Deng, Kangfa, Rohn, Mathias, Guenther, Margarita, Gerlach, Gerald
Published in Procedia engineering (2015)
Published in Procedia engineering (2015)
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Journal Article
Benzo-cyclo-butene bonding process with ‘stamp’ printing for wafer level package
Xia, Wen, Li, Lei, Deng, Kangfa, Li, Song, Su, Weiguo, Zhang, Wei
Published in Micro & nano letters (01.05.2014)
Published in Micro & nano letters (01.05.2014)
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Journal Article
Verfahren zur Herstellung von thermoelektrischen Bauelementen
Nielsch, Kornelius, Zhang, Qihao, Deng, Kangfa, Wilkens, Lennart, Savitha, Dutt Aditya, Reith, Heiko
Year of Publication 14.12.2023
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Year of Publication 14.12.2023
Patent
Method for sealing wafer-level micro-cavity based on BCB (benzocyclobutene) glue
DENG KANGFA, ZHENG HUAN, SU WEIGUO, ZHOU HAONAN, JIANG SHAOBO, ZHANG WEI, LI SONG
Year of Publication 20.05.2015
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Year of Publication 20.05.2015
Patent
Intelligent brake alarm system for preventing rear-end caused by automobile slam brake
DENG KANGFA, CHEN GUANGZHONG, SU WEIGUO, JIANG SHAOBO, ZHANG WEI, LI SONG
Year of Publication 10.04.2013
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Year of Publication 10.04.2013
Patent
Method for sealing wafer-level micro-cavity based on BCB (benzocyclobutene) glue
DENG KANGFA, ZHENG HUAN, SU WEIGUO, ZHOU HAONAN, JIANG SHAOBO, ZHANG WEI, LI SONG
Year of Publication 13.03.2013
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Year of Publication 13.03.2013
Patent
Thermal stress insulating MEMS micro heater interconnected substrate and method for manufacturing thermal stress insulating MEMS micro heater interconnected substrate
DENG KANGFA, ZHENG HUAN, SU WEIGUO, XIA WEN, WAN SONG, JIANG SHAOBO, ZHANG WEI, ZHU NINGLI, LI LEI
Year of Publication 04.09.2013
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Year of Publication 04.09.2013
Patent