TXRF capability of metallic contamination analysis on rough silicon wafers
Yim, Viviane, Mukhtarov, Anna, Drogue, Nathalie, Autillo, Delphine, Lardin, Thierry, Zussy, Marc, Dechamp, Jérôme, Truffier-Boutry, Delphine
Published in Journal of materials research (02.08.2024)
Published in Journal of materials research (02.08.2024)
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Journal Article
Initiated Chemical Vapor Deposition of polysiloxane as adhesive nanolayer for silicon wafer bonding
Montméat, Pierre, Dechamp, Jérôme, Enyedi, Grégory, Fournel, Frank, Zavvou, Zacharoula, Jousseaume, Vincent
Published in Materials science in semiconductor processing (01.09.2022)
Published in Materials science in semiconductor processing (01.09.2022)
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Journal Article
Enhanced thermal performances of silicon-on-diamond wafers incorporating ultrathin nanocrystalline diamond and silicon layers: Raman and micro-Raman analysis
Mazellier, Jean-Paul, Mermoux, Michel, Andrieu, Francois, Widiez, Julie, Dechamp, Jérôme, Saada, Samuel, Lions, Mathieu, Hasegawa, Masataka, Tsugawa, Kazuo, Bergonzo, Philippe, Faynot, Olivier
Published in Journal of applied physics (15.10.2011)
Published in Journal of applied physics (15.10.2011)
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Journal Article
Lamination of dry film epoxy molding compounds for 3D packaging: advances and challenges
Argoud, Maxime, Eleouet, Raphael, Dechamp, Jerome, Allouti, Nacima, Pain, Laurent, Tiron, Raluca, Mori, Daisuke, Asahara, Masahiro, Oi, Yosuke, Kan, Katsushi
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Full characterization of Cu/Cu direct bonding for 3D integration
Taibi, Rachid, Di Cioccio, Léa, Chappaz, Cedrick, Chapelon, Laurent-Luc, Gueguen, Pierric, Dechamp, Jérome, Fortunier, Roland, Clavelier, Laurent
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Copper direct bonding: An innovative 3D interconnect
Gueguen, Pierric, Di Cioccio, Léa, Morfouli, Panagiota, Zussy, Marc, Dechamp, Jérome, Bally, Laurent, Clavelier, Laurent
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Backside Thinning Process Development for High-Density TSV in a 3-Layer Integration
Bouis, Renan, Marchand, Jeremy, Andre, Agathe, Borel, Stephan, Dechamp, Jerome, Vignoud, Lionel, Valentin, Paul, Assous, Myriam, Hebras, Damien
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Low Resistance and High Isolation HD TSV for 3-Layer CMOS Image Sensors
Borel, Stephan, Assous, Myriam, Velard, Remi, Suarez-Berru, Jerzy-Javier, Nicolas, Stephane, Dechamp, Jerome, Bouis, Renan, Vignoud, Lionel, Valentin, Paul, Marchand, Jeremy, Roman, Antonio, Bedjaoui, Messaoud
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications
Nicolas, Stephane, Suarez-Berru, Jerzy-Javier, Bresson, Nicolas, Socquet-Clerc, Carole, Assous, Myriam, Borel, Stephan, Velard, Remi, Dechamp, Jerome, Bouis, Renan, Roman, Antonio, Abadie, Karine, Hebras, Damien
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Single-mode high frequency LiNbO3 Film Bulk Acoustic Resonator
Bousquet, Marie, Enyedi, Gregory, Dechamp, Jerome, Zussy, Marc, Pokam Kuisseu, Pauline Sylvia, Mazen, Frederic, Billard, Christophe, Reinhardt, Alexandre, Bertucchi, Michael, Perreau, Pierre, Castellan, Gael, Maeder-Pachurka, Catherine, Mercier, Denis, Delprato, Julien, Borzi, Aurelio, Sejil, Selsabil
Published in 2019 IEEE International Ultrasonics Symposium (IUS) (01.10.2019)
Published in 2019 IEEE International Ultrasonics Symposium (IUS) (01.10.2019)
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Conference Proceeding
Haptic Interface Based on an Innovative "Piezo-in-Flex" Piezoelectric Patch Technology
Casset, Fabrice, Mendes, Munique Kazar, David, Nadine, Franiatte, Remi, Mermin, Daniel, Zussy, Marc, Dechamp, Jerome, Castagne, Laetitia, Souriau, Jean-Charles, Benedetto, Kevin, Colin, Mikael
Published in 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) (25.06.2023)
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Published in 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) (25.06.2023)
Conference Proceeding
Scalable Through Molding Interconnection realization for advanced Fan Out Wafer Level Packaging applications
Plihon, Aurelia, Deschaseaux, Edouard, Franiatte, Remi, Dechamp, Jerome, Vaudaine, Simon, Guillaume, Jennifer, Brunet-Manquat, Catherine, Moreau, Stephane, Coudrain, Perceval
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Through Mold Interconnection assessment for advanced Fan Out Wafer Level Packaging applications
Plihon, Aurelia, Deschaseaux, Edouard, Franiatte, Remi, Argoux, Maxime, Dechamp, Jerome, Guillaume, Jennifer, Charbonnier, Jean
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
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Conference Proceeding
Thermomechanical Characterization of Polymer Thin Films. Application for the Conception and the Manufacturing of a 3D Interposer
Vignoud, Lionel, Assigbe, Nicolas, Morin, Christine, Dechamp, Jerome, Roulet, Lucile, Parry, Guillaume, Estevez, Rafael
Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
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Conference Proceeding