Bond Wire Damage Detection and State of Health Estimation of a 1200V, 900A Dual Pack IGBT Power Module using the RL-Equivalent Circuit
Hanif, Abu, Major, Joshua, DeVoto, Douglas, Khan, Faisal
Published in 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2019)
Published in 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2019)
Get full text
Conference Proceeding
Impact of Accelerated Stress-Tests on SiC MOSFET Precursor Parameters
Kozak, Joseph P., Ngo, Khai D.T., DeVoto, Douglas J., Major, Joshua J.
Published in 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) (01.06.2018)
Published in 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) (01.06.2018)
Get full text
Conference Proceeding
PCB-on-DBC GaN Power Module Design with High-Density Integration and Double-Sided Cooling
Tian, Xingyue, Jia, Niu, DeVoto, Douglas, Paret, Paul, Bai, Hua, Tolbert, Leon M., Cui, Han
Published in IEEE transactions on power electronics (05.09.2023)
Get full text
Published in IEEE transactions on power electronics (05.09.2023)
Journal Article
PCB-on-DBC GaN Power Module Design With High-Density Integration and Double-Sided Cooling
Tian, Xingyue, Jia, Niu, DeVoto, Douglas, Paret, Paul, Bai, Hua, Tolbert, Leon M., Cui, Han
Published in IEEE transactions on power electronics (01.01.2024)
Published in IEEE transactions on power electronics (01.01.2024)
Get full text
Journal Article
Reliability Analysis of Large-Area, Low Pressure-Assisted Silver Sintering for Medium-Voltage Power Modules
Gersh, Jacob, DiMarino, Christina, DeVoto, Douglas, Paret, Paul, Major, Joshua
Published in IEEE journal of emerging and selected topics in power electronics (08.12.2021)
Get full text
Published in IEEE journal of emerging and selected topics in power electronics (08.12.2021)
Journal Article
Ultracompliant Heterogeneous Copper–Tin Nanowire Arrays Making a Supersolder
Gong, Wei, Li, Pengfei, Zhang, Yunheng, Feng, Xuhui, Major, Joshua, DeVoto, Douglas, Paret, Paul, King, Charles, Narumanchi, Sreekant, Shen, Sheng
Published in Nano letters (13.06.2018)
Published in Nano letters (13.06.2018)
Get full text
Journal Article
Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages
Pahinkar, Darshan G., Puckett, Waylon, Graham, Samuel, Boteler, Lauren, Ibitayo, Dimeji, Narumanchi, Sreekant, Paret, Paul, DeVoto, Douglas, Major, Joshua
Published in Advanced engineering materials (01.10.2018)
Published in Advanced engineering materials (01.10.2018)
Get full text
Journal Article
Reliability Analysis of Large-Area, Low-Pressure-Assisted Silver Sintering for Medium-Voltage Power Modules
Gersh, Jacob, DiMarino, Christina, DeVoto, Douglas, Paret, Paul P., Major, Joshua
Published in IEEE journal of emerging and selected topics in power electronics (01.10.2022)
Published in IEEE journal of emerging and selected topics in power electronics (01.10.2022)
Get full text
Journal Article
Correction to Ultracompliant Heterogeneous Copper–Tin Nanowire Arrays Making A Supersolder
Gong, Wei, Li, Pengfei, Zhang, Yunheng, Feng, Xuhui, Major, Joshua, DeVoto, Douglas, Paret, Paul, King, Charles, Narumanchi, Sreekant, Shen, Sheng
Published in Nano letters (11.07.2018)
Published in Nano letters (11.07.2018)
Get full text
Journal Article
Reliability and Lifetime Prediction Model of Sintered Silver Under High-Temperature Cycling
Paret, Paul, Major, Joshua, DeVoto, Douglas, Narumanchi, Sreekant, Ding, Chao, Lu, Guo-Quan
Published in IEEE journal of emerging and selected topics in power electronics (01.10.2022)
Published in IEEE journal of emerging and selected topics in power electronics (01.10.2022)
Get full text
Journal Article
Parametric Design Study of a Power Electronics Package for Improving Solder Joint Reliability
Paret, Paul, DeVoto, Douglas, Major, Joshua, Narumanchi, Sreekant
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Get full text
Conference Proceeding
Evaluation of Low-Pressure-Sintered Multi-Layer Substrates for Medium-Voltage SiC Power Modules
Gersh, Jacob, DiMarino, Christina, DeVoto, Douglas, Paret, Paul, Major, Joshua, Gage, Samuel
Published in 2021 IEEE Applied Power Electronics Conference and Exposition (APEC) (14.06.2021)
Published in 2021 IEEE Applied Power Electronics Conference and Exposition (APEC) (14.06.2021)
Get full text
Conference Proceeding
Analysis and Optimization of a Multi-Layer Integrated Organic Substrate for High Current GaN HEMT-Based Power Module
Gurpinar, Emre, Sahu, Raj, Ozpineci, Burak, DeVoto, Douglas
Published in 2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) (23.09.2020)
Published in 2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) (23.09.2020)
Get full text
Conference Proceeding
Development of a 250°C 15kV Supercascode switch using SiC JFET technology
Sanabria, David E., Appert, Randy, Pronko, Steven G. E., Major, Joshua, DeVoto, Douglas, Heinselman, Karen, Lehr, Jane M., Gonzalez, Nicolas, Ginley, David S.
Published in 2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA) (07.11.2022)
Published in 2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA) (07.11.2022)
Get full text
Conference Proceeding