77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing
Sun, Mei, Guan Lim, Teck, Soon Wee Ho, David, Wu, Jiaqi, Chai, Tai Chong, Ma, Yugang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2024)
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Journal Article
Through Mold Vertical Interconnect Formation in FOWLP using conductive paste
Siew Boon, Serine Soh, David Ho, Soon Wee, Jaafar, Norhanani
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
3D FOWLP Integration
Guan, Lim Teck, Soon Wee Ho, David, Chong, Chai Tai, Bhattacharya, Surya
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers
Nair Gourikutty, Sajay Bhuvanendran, Wu, Jiaqi, Lim, Teck Guan, Sandra, San, Jong, Ming Chinq, Lai Yee, Chia, Long, Lau Boon, Soon Wee Ho, David, Choong, Chong Ser, Liang, Ding, Tu, Xiaoguang, Wang, Wanjun, Tan, Chee-Keong, See, Alison, Wang, Hsiu-Che, Coccioli, Roberto, Tan, Ronson, Nagarajan, Radhakrishnan, Bhattacharya, Surya
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package
Chong, Chai Tai, Teck Guan, Lim, Yong, Han, Che, F. X., Ho Soon Wee, David, Chong, Ser Choong
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Automated Attribute Measurements of Buried Package Features in 3D X-ray Images using Deep Learning
Pahwa, Ramanpreet Singh, Lay Nwe, Ma Tin, Chang, Richard, Min, Oo Zaw, Jie, Wang, Gopalakrishnan, Saisubramaniam, Soon Wee, David Ho, Qin, Ren, Rao, Vempati Srinivasa, Dai, Haiwen, Neumann, Jens Timo, Pichumani, Ramani, Gregorich, Tom
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres
Nair Gourikutty, Sajay Bhuvanendran, Long, Lau Boon, Wei, Seit Wen, Jong, Ming Chinq, Wee Ho, David Soon, Wu, Jiaqi, Lim, Teck Guan, Mandal, Rathin, Choong, Chong Ser, Yee, Chia Lai, Li, Xin, Liow, Jason Tsung-Yang, Bhattacharya, Surya
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
FOWLP electrical performances
Guan, Lim Teck, Fai, Chan Kai, Soon Wee, David Ho
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Study on bottom-up Cu filling process for Through Silicon Via (TSV) metallization
Hwang, Gilho, Hsiang-Yao, Hsiao, Wee, David Ho Soon
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding
FOWLP and Si-Interposer for High-Speed Photonic Packaging
Guan, Lim Teck, Ching, Eva Wai Leong, Ching, Jong Ming, Leng, Loh Woon, Wee, David Ho Soon, Bhattacharya, Surya
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
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Conference Proceeding
Laser drilling and Plasma Cleaning Process for Blind Via Through Mold Interconnect
Hsiao, Hsiang-Yao, Wee Ho, David Soon, Sing Lim, Keith Cheng, Chong, Ser Choong, Chai, Tai Chong, Schutzberger, David, Oz, Yariv, Amrani, Guy, Zhao, Jack, Toh, Johnson
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packaging
Lianto, Prayudi, Tan, Chin Wei, Jie Peng, Qi, Jumat, Abdul Hakim, Dai, Xundong, Peter Fung, Khai Mum, Huei See, Guan, Chong, Ser Choong, Wee David Ho, Soon, Serine Soh, Siew Boon, Huang Sharon Lim, Seow, Calvin Chua, Hung Ming, Abdillah Haron, Ahmad, Kenneth Lee, Huan Ching, Zhang, Mingsheng, Ko, Zhi Hao, Ko San, Ye, Leong, Henry
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
NetFlex: A 22nm Multi-Chiplet Perception Accelerator in High-Density Fan-Out Wafer-Level Packaging
Chou, Teyuh, Tang, Wei, Rotaru, Mihai D., Liu, Chester, Dutta, Rahul, Pei Siang, Sharon Lim, Wee, David Ho Soon, Bhattacharya, Surya, Zhang, Zhengya
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
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Conference Proceeding
Development of Package-on-Package Using Embedded Wafer-Level Package Approach
Ser Choongv Chong, Wee, David Ho Soon, Rao, Vempati Srinivasa, Vasarla, Nagendra Sekhar
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2013)
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Journal Article
Realization of High Aspect Ratio Through Mold Interconnect (TMI) using Vertical Wire
Wai, Leong Ching, Wee, David Ho Soon, Choong, Chong Ser
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Process Development of Fan-Out with Multi-layer RDL for Chiplets Packaging
Hsiang-Yao, Hsiao, Soon Wee, David Ho, PS, Sharon Lim
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Assembly challenges and demonstrations of ultra-large Antenna in Package for Automotive Radar applications
Lim, Sharon Pei Siang, Chong, Ser Choong, Wee, David Ho Soon, Chai, Tai Chong
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Co-packaging of PMUT array with FOWLP ASIC's
Giusti, Domenico, Quaglia, Fabio, Rahul, Dutta, Rao, Vempati Srinivasa, Savoia, Alessandro, Shaw, Mark, Wee, David Ho Soon
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding