by Fernandez, D. M., Rao, V. S., David, S. W. H., Justin, W. H. S. T., Li Yan Siow
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)

by Lim Ying Ying, David, H. S. W., Chong Ser Choong, Myo Ei Pa Pa, Lim Teck Guan
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)

by Justin, W H S T, Tai Chong Chai, Rao, V S, David, S W H, Fernandez, D M, Li Yan Siow, Wen Sheng Lee, Serene, M L T, Lee, J
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)

by DAVID W H E T S TO N E
Published in Evening chronicle (Newcastle-upon-Tyne, England) (26.06.2010)

by LEUNG,DAVID W.-H.,US, HITZEMAN,RONALD A.,US
Year of Publication 22.02.1984

by DING PING,HENRIE ROBERT N. II,COHEN DANIEL H.,LYGA JOHN W.,ROSEN DAVID S.,THEODORIDIS GEORGE,ZHANG QUN,YEAGER WALTER H.,DONOVAN STEPHEN F.,ZHANG STEVEN SHUNXIANG,SHULMAN INNA,YU SEONG JAE,WANG GUOZHI, TIN DENNIS L.,RENSNER PAUL E.,SILVERMAN IAN R.,CULLEN THOMAS G
Year of Publication 08.03.2006

by DING PING,HENRIE ROBERT N. II,COHEN DANIEL H.,LYGA JOHN W.,ROSEN DAVID S.,THEODORIDIS GEORGE,ZHANG QUN,YEAGER WALTER H.,DONOVAN STEPHEN F.,ZHANG STEVEN SHUNXIANG,SHULMAN INNA,YU SEONG JAE,WNAG GOUZHI, TIN DENNIS L.,RENSNER PAUL E.,SILVERMAN IAN R.,CULLEN THOMAS G
Year of Publication 01.02.2006