Universal Chiplet Interconnect Express: An Open Industry Standard for Memory and Storage Applications
Sharma, Debendra Das, Coughlin, Thomas, Coughlin, Tom
Published in Computer (Long Beach, Calif.) (01.01.2024)
Published in Computer (Long Beach, Calif.) (01.01.2024)
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Journal Article
Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level
Das Sharma, Debendra, Pasdast, Gerald, Qian, Zhiguo, Aygun, Kemal
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2022)
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Journal Article
Invited: Compute Express Link™ (CXL™): An Open Interconnect for Cloud Infrastructure
Sharma, Debendra Das
Published in 2023 60th ACM/IEEE Design Automation Conference (DAC) (09.07.2023)
Published in 2023 60th ACM/IEEE Design Automation Conference (DAC) (09.07.2023)
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Conference Proceeding
Compute Express Link®: An open industry-standard interconnect enabling heterogeneous data-centric computing
Sharma, Debendra Das
Published in 2022 IEEE Symposium on High-Performance Interconnects (HOTI) (01.08.2022)
Published in 2022 IEEE Symposium on High-Performance Interconnects (HOTI) (01.08.2022)
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Conference Proceeding
다이-투-다이 인터커넥트의 컴플라이언스 및 디버그 테스트
DAS SHARMA DEBENDRA, WU ZUOGUO, LANKA NARASIMHA, SESHAN LAKSHMIPRIYA, CHOUDHARY SWADESH, PASDAST GERALD
Year of Publication 16.08.2024
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Year of Publication 16.08.2024
Patent
다이-투-다이 인터커넥트 프로토콜 계층
DAS SHARMA DEBENDRA, WU ZUOGUO, LANKA NARASIMHA, SESHAN LAKSHMIPRIYA, CHOUDHARY SWADESH, PASDAST GERALD
Year of Publication 16.08.2024
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Year of Publication 16.08.2024
Patent
다이 대 다이 인터커넥트를 위한 링크 초기화 트레이닝 및 브링업
DAS SHARMA DEBENDRA, WU ZUOGUO, LANKA NARASIMHA, SESHAN LAKSHMIPRIYA, CHOUDHARY SWADESH, PASDAST GERALD
Year of Publication 16.08.2024
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Year of Publication 16.08.2024
Patent
다이-투-다이 어댑터
DAS SHARMA DEBENDRA, WU ZUOGUO, LANKA NARASIMHA, SESHAN LAKSHMIPRIYA, CHOUDHARY SWADESH, PASDAST GERALD
Year of Publication 08.08.2024
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Year of Publication 08.08.2024
Patent