Cascaded collimator for atomic beams traveling in planar silicon devices
Li, Chao, Chai, Xiao, Wei, Bochao, Yang, Jeremy, Daruwalla, Anosh, Ayazi, Farrokh, Raman, C.
Published in Nature communications (23.04.2019)
Published in Nature communications (23.04.2019)
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Journal Article
Low motional impedance distributed Lamé mode resonators for high frequency timing applications
Daruwalla, Anosh, Wen, Haoran, Liu, Chang-Shun, Ayazi, Farrokh
Published in Microsystems & nanoengineering (15.06.2020)
Published in Microsystems & nanoengineering (15.06.2020)
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Journal Article
Robust characterization of microfabricated atomic beams on a six-month time scale
Li, Chao, Wei, Bochao, Chai, Xiao, Yang, Jeremy, Daruwalla, Anosh, Ayazi, Farrokh, Raman, C.
Published in Physical review research (29.05.2020)
Published in Physical review research (29.05.2020)
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Journal Article
Environmentally-Robust High-Performance Silicon TIMU Chip
Ayazi, Farrokh, Wen, Haoran, Daruwalla, Anosh, Gupta, Pranav
Published in 2020 IEEE/ION Position, Location and Navigation Symposium (PLANS) (01.04.2020)
Published in 2020 IEEE/ION Position, Location and Navigation Symposium (PLANS) (01.04.2020)
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Conference Proceeding
Hermetically-Encapsulated Unidirectional Accelerometer Contact Microphone for Wearable Applications
Gupta, Pranav, Wen, Haoran, Daruwalla, Anosh, Moghimi, Mohammad J., Ayazi, Farrokh
Published in 2019 IEEE SENSORS (01.10.2019)
Published in 2019 IEEE SENSORS (01.10.2019)
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Conference Proceeding
High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging
Ayazi, Farrokh, Wen, Haoran, Jeong, Yaesuk, Gupta, Pranav, Daruwalla, Anosh, Liu, Chang-Shun
Published in 2019 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2019)
Published in 2019 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2019)
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Conference Proceeding
A piezo-capacitive BAW accelerometer with extended dynamic range using a gap-changing moving electrode
Daruwalla, Anosh, Wen, Haoran, Liu, Chang-Shun, Jeong, Hoon, Ayazi, Farrokh
Published in 2018 IEEE/ION Position, Location and Navigation Symposium (PLANS) (01.04.2018)
Published in 2018 IEEE/ION Position, Location and Navigation Symposium (PLANS) (01.04.2018)
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Conference Proceeding
Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip
Wen, Haoran, Daruwalla, Anosh, Jeong, Yaesuk, Gupta, Pranav, Choi, Jaehoo, Liu, Chang-Shun, Ayazi, Farrokh
Published in 2018 IEEE/ION Position, Location and Navigation Symposium (PLANS) (01.04.2018)
Published in 2018 IEEE/ION Position, Location and Navigation Symposium (PLANS) (01.04.2018)
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Conference Proceeding