656
Watcha, D, Brown, J, Darnauer, J, Sarin, R, Glover, G, Mackey, S
Published in The journal of pain (01.04.2007)
Published in The journal of pain (01.04.2007)
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Journal Article
Interchangeable pin routing with application to package layout
Man-Fai Yu, Darnauer, J., Dai, W.W.-M.
Published in Proceedings of International Conference on Computer Aided Design (1996)
Published in Proceedings of International Conference on Computer Aided Design (1996)
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Conference Proceeding
(656): Processing of motor, tonic pain, and phasic pain signals in the human spinal cord
Watcha, D., Brown, J., Darnauer, J., Sarin, R., Glover, G., Mackey, S.
Published in The journal of pain (2007)
Published in The journal of pain (2007)
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Journal Article
Fast pad redistribution from periphery-IO to area-IO
Darnauer, J., Dai, W.W.-M.
Published in Proceedings of IEEE Multi-Chip Module Conference (MCMC-94) (1994)
Published in Proceedings of IEEE Multi-Chip Module Conference (MCMC-94) (1994)
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Conference Proceeding
Electrical evaluation of flip-chip package alternatives for next generation microprocessors
Darnauer, J., Chengson, D., Schmidt, B., Priest, E., Petefish, B., Hanson, D., Gore, W.L.
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
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Conference Proceeding
Journal Article
Tradeoffs in chip and substrate complexity and cost for field programmable multichip modules
Darnauer, J., Wayne Wei-Ming Dai
Published in 1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon (1996)
Published in 1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon (1996)
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Conference Proceeding
Journal Article
Electrical evaluation of flip-chip package alternatives for next generation microprocessors
Darnauer, J., Chengson, D., Schmidt, B., Priest, E., Hanson, D.A., Petefish, W.G.
Published in IEEE transactions on advanced packaging (01.08.1999)
Published in IEEE transactions on advanced packaging (01.08.1999)
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Journal Article
Conference Proceeding
A 1024-pin plastic ball grid array for flip chip die
Switky, A., Sajja, V., Darnauer, J., Dai, W.W.M.
Published in 1994 Proceedings. 44th Electronic Components and Technology Conference (1994)
Published in 1994 Proceedings. 44th Electronic Components and Technology Conference (1994)
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Conference Proceeding
A silicon-on-silicon field programmable multichip module (FPMCM) integrating FPGA and MCM technologies
Darnauer, J., Isshiki, T., Garay, P., Ramirez, J., Maheshwari, V., Dai, W.W.-M.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.11.1995)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.11.1995)
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Journal Article
Conference Proceeding
Design of FPGAs with Area I/O for Field Programmable MCM
Maheshwari, V., Darnauer, J., Ramirez, J., Dai, W.W.
Published in Third International ACM Symposium on Field-Programmable Gate Arrays (1995)
Published in Third International ACM Symposium on Field-Programmable Gate Arrays (1995)
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Conference Proceeding
Correction to "A Silicon-on-Silicon Field Programmable Multichip Module (FPMCM)--Integrating FPGA an
Darnauer, J., Isshiki, T., Garay, P., Ramirez, J., Maheshwari, V., Wei-Ming, W.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1996)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1996)
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Journal Article
A field programmable multi-chip module (FPMCM)
Darnauer, J., Garay, P., Isshiki, T., Ramirez, J., Wei-Ming Dai, W.
Published in Proceedings of IEEE Workshop on FPGA's for Custom Computing Machines (1994)
Published in Proceedings of IEEE Workshop on FPGA's for Custom Computing Machines (1994)
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Conference Proceeding