Reliability Investigation of a Carbon Nanotube Array Thermal Interface Material
Nylander, Andreas, Hansson, Josef, Kabiri Samani, Majid, Chandra Darmawan, Christian, Borta Boyon, Ana, Divay, Laurent, Ye, Lilei, Fu, Yifeng, Ziaei, Afshin, Liu, Johan
Published in Energies (Basel) (2019)
Published in Energies (Basel) (2019)
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Journal Article
Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications
Wang, Nan, Chen, Shujing, Nkansah, Amos, Darmawan, Christian Chandra, Ye, Lilei, Liu, Johan
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
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Conference Proceeding
Thermal Reliability Study of Polymer Bonded Carbon Nanotube Array Thermal Interface Materials
Nylander, Andreas, Darmawan, Christian Chandra, Boyon, Ana Borta, Divay, Laurent, Samani, Majid Kabiri, Ras, Mohamad Abo, Fortel, Julien, Fu, Yifeng, Ye, Lilei, Ziaei, Afshin, Liu, Johan
Published in 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2018)
Published in 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2018)
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Conference Proceeding
Graphene-CNT hybrid material as potential thermal solution in electronics applications
Darmawan, Christian Chandra, Lilei Ye, Samani, Majid Kabiri, Yifeng Fu, Liu, Johan
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
Published in 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01.06.2017)
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Conference Proceeding
Design and realization of characterization demonstrator to investigate thermal performance of vertically-aligned carbon nanotubes TIM for avionics and aerospace applications
Ras, Mohamad Abo, von Essen, Tobias, Fortel, Julien, Panchal, Pranav, Divay, Laurent, Borta-Boyon, Ana, May, Daniel, Darmawan, Christian Chandra, Samani, Majid Kabiri, Wunderle, Bernhard, Ziaei, Afshin
Published in 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2017)
Published in 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2017)
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Conference Proceeding