Low temperature FIB cross section: Application to indium micro bumps
Dantas de Morais, L., Chevalliez, S., Mouleres, S.
Published in Microelectronics and reliability (01.09.2014)
Published in Microelectronics and reliability (01.09.2014)
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Journal Article
Conference Proceeding
Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing
Aubert, A., Rebrassé, J.P., Dantas de Morais, L., Labat, N., Frémont, H.
Published in Microelectronics and reliability (01.09.2010)
Published in Microelectronics and reliability (01.09.2010)
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Journal Article
Conference Proceeding
Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations
Aubert, A., Dantas de Morais, L., Rebrassé, J.-P.
Published in Microelectronics and reliability (01.08.2008)
Published in Microelectronics and reliability (01.08.2008)
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Journal Article
Conference Proceeding
Evidence of vacuum between buckled films and their substrates
Coupeau, C., Grilhé, J., Dion, E., de Morais, L. Dantas, Colin, J.
Published in Thin solid films (01.07.2010)
Published in Thin solid films (01.07.2010)
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Journal Article
Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections
de Morais, L. Dantas, Allanic, F., Roqueta, F., Rebrasse, J.P.
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
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Journal Article
Conference Proceeding
Localization of sensitive areas of power AC switch under thermal laser stimulation
Debleds, S., Rebrasse, J.P., de Morais, L. Dantas, Frapreau, I., Perdreau, R., Morillon, B.
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
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Journal Article
Conference Proceeding
Extended Reliability Study of High Density PZT Capacitors: Intrinsic Lifetime Determination and Wafer Level Screening Strategy
Bouyssou, E., Guegan, G., Bruyere, S., Pezzani, R., Berneux, L., de Morais, L. Dantas, Rebrasse, J.-P., Anceau, C., Nopper, C.
Published in 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual (01.04.2007)
Published in 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual (01.04.2007)
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Conference Proceeding
Backside Hot Spot Detection Using Liquid Crystal Microscopy
Crepel, O., Beaudoin, F., Dantas de Morais, L., Haller, G., Goupil, C, Perdu, P., Desplats, R., Lewis, D.
Published in Microelectronics and reliability (01.09.2002)
Published in Microelectronics and reliability (01.09.2002)
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Journal Article