Surface roughness effect on copper–alumina adhesion
Lim, Ju Dy, Susan, Yeow Su Yi, Daniel, Rhee MinWoo, Leong, Kam Chew, Wong, Chee Cheong
Published in Microelectronics and reliability (01.09.2013)
Published in Microelectronics and reliability (01.09.2013)
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Journal Article
Conference Proceeding
Plasma Chamber Environment Control to Enhance Bonding Strength for Wafer-to-Wafer Bonding Processing
Kim, Wooyoung, Lee, Yongin, Choi, Wonyoung, Lim, Kyeongbin, Moon, BumKi, Minwoo Rhee, Daniel
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Design and Simulation of Symmetric Wafer-to-Wafer Bonding Compesating a Gravity Effect
Lim, Kyeongbin, Han, Minsoo, Jo, Gwanghee, Yun, Hyeonjun, Lee, Jewon, Kim, Jun Hyung, Seok, SeungDae, Rhee, Minwoo Daniel
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Study on Process Induced Wafer Level Warpage of Fan-Out Wafer Level Packaging
Che, F. X., Ho, David, Mian Zhi Ding, MinWoo, Daniel Rhee
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Chip level evaluation of wafer-to-wafer direct bonding strength with bending test
Baek, Kyungmin, Kim, Juno, Han, Min-soo, Lim, Kyeongbin, Rhee, Daniel Minwoo
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
A Performance Testing Method of Bernoullie Picker for Ultra-Thin Die Handling Application
Kim, Juno, Min, Dae Ho, Lee, Kangsan, Lee, Mingu, Lim, Kyeongbin, Rhee, Daniel Minwoo
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Alignment Vision System for Hybrid Bonding
Nagatomo, Daisuke, Sugiura, Takamasa, Kajinami, Masato, Ueyama, Shinji, Tokumiya, Takahiro, Oh, Seungyeol, Ahn, Sungmin, Choi, Euisun, Woo, Siwoong, Lee, Hyunjin, Lee, Byungjoon, Rhee, Minwoo Daniel
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Edge Detection Algorithm for Blurred Alignment Marks in Hybrid Bonding
Sugiura, Takamasa, Nagatomo, Daisuke, Kajinami, Masato, Ueyama, Shinji, Tokumiya, Takahiro, Oh, Seungyeol, Ahn, Sungmin, Choi, Euisun, Woo, Siwoong, Lee, Hyunjin, Lee, Byungjoon, Rhee, Minwoo Daniel
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Finite Element Modeling for Wafer-to-Wafer Direct Bonding Behaviors and Alignment Prediction
Baek, Kyungmin, Han, Min-soo, Han, Il Young, Shin Lee, Jung, Sim, Jaeuk, Lee, Joongha, Min, Daeho, Lim, Kyeongbin, Rhee, Minwoo Daniel
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Copper contamination control in Hybrid Copper Bonding
Kim, Wooyoung, Han, Seung Ho, Lee, Yongin, Shin, Donggap, Choi, Wonyoung, Moon, Jiwon, Lim, Kyeongbin, Moon, BumKi, Rhee, Minwoo Daniel
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
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Conference Proceeding
Modeling of Spreading Behavior of UV-Curable Dielectric Ink from its Rheological Characteristics
Kang, Sujie, Lee, Jung Shin, Woo Cho, Jung, Park, Sun Woo, Lee, Seungdon, Lee, Hyunjin, Rhee, Daniel Minwoo
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Non Conductive Film Analysis Using Cure Kinetics and Rheokinetics for Gang Bonding Process for 3DIC TSV Packaging
Moon, Ji Young, Shin, Yongchul, Kim, Sumin, Hahn, Seung Ho, Lim, Kyeongbin, Jung, Jung Woo, Lim, Chaemook, Kim, Youngbum, Hwang, Jihwan, Rhee, Minwoo Daniel
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
An efficient single phase liquid cooling system for microelectronic devices with high power chip
Gongyue Tang, Yong Han, Boon Long Lau, Xiaowu Zhang, Rhee, Daniel MinWoo
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Miniaturization of bio-fluidic package for point-of-care diagnostic
Hwang How Yuan, Lee Tae Yoon, Ding Mian Zhi, Chung Jaehoon, Minwoo, Daniel Rhee
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
High temperature die attach material on ENEPIG surface for high temperature (250DegC/500hour) and temperature cycle (−65 to +150DegC) applications
Leong Ching Wai, Seit Wen Wei, Hwang How Yuan, MinWoo, Daniel Rhee
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Study on silver sintered die attach material with different metal surfaces for high temperature and high pressure (300°c/30kpsi) applications
Leong Ching Wai, Wen Wei Seit, Rong, Eric Phua Jian, Mian Zhi Ding, Rao, Vempati Srinivasa, MinWoo, Daniel Rhee
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding