Spatial-Temporal Evolution and Prediction of Carbon Storage: An Integrated Framework Based on the MOP–PLUS–InVEST Model and an Applied Case Study in Hangzhou, East China
Li, Yonghua, Yao, Song, Jiang, Hezhou, Wang, Huarong, Ran, Qinchuan, Gao, Xinyun, Ding, Xinyi, Ge, Dandong
Published in Land (Basel) (01.12.2022)
Published in Land (Basel) (01.12.2022)
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Journal Article
Research on spatial differentiation and influencing factors of rural tourism industry based on POI data mining: A case study of Zhejiang province
Ge, Dandong, Zheng, Yanyan, Tong, Lei
Published in Zhejiang da xue xue bao. Journal of Zhejiang University. Sciences edition. Li xue ban (01.07.2023)
Published in Zhejiang da xue xue bao. Journal of Zhejiang University. Sciences edition. Li xue ban (01.07.2023)
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Journal Article
Spatio-Temporal Pattern and Influence Mechanism of Rural Human Settlements System Resilience: Case from China
Ge, Dandong, Zheng, Yanyan, Zhang, Shenning, Fu, Jiayi, Su, Fei
Published in Sustainability (01.11.2022)
Published in Sustainability (01.11.2022)
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Journal Article
Impact of Young Modulus of Epoxy Glue to Copper Wire Bonding
Tan, K.G., Chung, E.L., Wai, C.M., Dandong, Ge
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
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Conference Proceeding
Glue selection for robust wire bonding process related to non-stick on pad
Ee Lin Chung, Dandong Ge, Chee Mun Wai
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
Effect of moisture related properties of mold compound on the reliability of power packages
Dandong Ge, Xue Ming, Wenjie Shen, Zhao Yun
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
Creep corrosion on uppf lead frame package caused by packing materials
Huan Xu, Kaur, Harvinderpal, Lim, Wee Kiat Crosby, Dandong Ge, Kumara, Kurnia, Ming Xue
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Study on creep fatigue behaviour of soft solders die attach for power package applications
Dandong Ge, Che, F. X., Yik Siong Tay, Swee Lee Gan, Yazid, M.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Creep properties of soft solder die attach with Ni balls in power package applications
Che, F. X., Dandong Ge, Yik Siong Tay, Yazid, M., Swee Lee Gan
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding
Semi-quantitative analysis of trace elements by Secondary Ion Mass Spectrometry
Dandong Ge, Harald, P, Gan Swee Lee, Koh, L K I
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
The impact of high glass transition temperature of molding compounds on power package warpage and stress performance
Ge, Dandong, Subramanian, N. R., Yong, Khai Seen, Foo, Mun Yee, Gan, Swee Lee
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Test pin configuration for test device for testing devices under test
Sugianto, Yusman, Swee Lee, Gan, Chyeo Yong, Tay, Tan, Wee Kuan, Hudda, Murad, Hiew, Fu San, Yussuff, Arieff Ridzwan, Tan, Siao Kiat, Xiaojun, Wang, Dandong, Ge, Chow York, Lee
Year of Publication 05.02.2019
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Year of Publication 05.02.2019
Patent
Test Pin Configuration for Test Device for Testing Devices Under Test
TAN Wee Kuan, HIEW Fu San, TAN Siao Kiat, YUSSUFF Arieff Ridzwan, CHYEO YONG Tay, SUGIANTO Yusman, CHOW YORK Lee, SWEE LEE Gan, DANDONG Ge, HUDDA Murad, XIAOJUN Wang
Year of Publication 22.06.2017
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Year of Publication 22.06.2017
Patent
Prüfstiftkonfiguration für eine Prüfvorrichtung zum Prüfen von Prüflingen
Sugianto, Yusman, Gan, Swee Lee, Hudda, Murad, Tan, Wee Kuan, Hiew, Fu San, Yussuff, Arieff Ridzwan, Lee, Chow York, Tan, Siao Kiat, Ge, Dandong, Wang, Xiaojun, Tay, Chyeo Yong
Year of Publication 22.06.2017
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Year of Publication 22.06.2017
Patent