TSV interposer fabrication for 3D IC packaging
Rao, Vempati Srinivasa, Wee, Ho Soon, Vincent, Lee Wen Sheng, Yu, Li Hong, Ebin, Liao, Nagarajan, Ranganathan, Chong, Chai Tai, Zhang, Xiaowu, Damaruganath, Pinjala
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections
Khan, N., Li Hong Yu, Tan Siow Pin, Soon Wee Ho, Kripesh, V., Pinjala, D., Lau, J. H., Toh Kok Chuan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2013)
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Journal Article
Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects
Aibin Yu, Lau, J. H., Soon Wee Ho, Kumar, A., Wai Yin Hnin, Wen Sheng Lee, Ming Ching Jong, Sekhar, V. N., Kripesh, V., Pinjala, D., Chen, S., Chien-Feng Chan, Chun-Chieh Chao, Chi-Hsin Chiu, Chih-Ming Huang, Chen, C.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2011)
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Journal Article
Low cost 4-channel CWDM splitter using SiOB packaging
Li, J., Goh, J.K.H., Lee, B.S.P., Zhang, Q.X., Ramana, P.V., Damaruganath Pinjala
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Development of Large Die Fine-Pitch Cu/Low- k FCBGA Package With Through Silicon via (TSV) Interposer
Tai Chong Chai, Xiaowu Zhang, Lau, J H, Selvanayagam, C S, Damaruganath, P, Hoe, Y Y G, Yue Ying Ong, Rao, V S, Wai, E, Hong Yu Li, Liao, E B, Ranganathan, N, Vaidyanathan, K, Shiguo Liu, Jiangyan Sun, Ravi, M, Vath, C J, Tsutsumi, Y
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2011)
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Journal Article
Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages
Aibin Yu, Khan, N., Archit, G., Pinjala, D., Kok Chuan Toh, Kripesh, V., Seung Wook Yoon, Lau, J.H.
Published in IEEE transactions on components and packaging technologies (01.09.2009)
Published in IEEE transactions on components and packaging technologies (01.09.2009)
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Journal Article
Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material
Rao, V. S., Sekhar, V. N., Ho Soon Wee, Rajoo, R., Sharma, G., Lim Ying Ying, Damaruganath, P.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2012)
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Journal Article
CORROSION PREVENTIVE HEATSINK FOR NETWORK DEVICE
Shivashankara, Manjunatha Reddy, Mehdiratta, Sandeep, Cap, Mehmet Onder, Pinjala, Damaruganath, Boopalan, Manigandan, Goergen, Joel Richard
Year of Publication 27.06.2024
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Year of Publication 27.06.2024
Patent
Low-Stress Bond Pad Design for Low-Temperature Solder Interconnections on Through-Silicon Vias (TSVs)
Xiaowu Zhang, Rajoo, R, Selvanayagam, C S, Premachandran, C S, Won Kyoung Choi, Soon Wee Ho, Siong Chiew Ong, Ling Xie, Pinjala, D, Dim-Lee Kwong, Yee Mong Khoo, Shan Gao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2011)
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Journal Article
Corrosion preventive heatsink for network device
Shivashankara, Manjunatha Reddy, Mehdiratta, Sandeep, Cap, Mehmet Onder, Pinjala, Damaruganath, Boopalan, Manigandan, Goergen, Joel Richard
Year of Publication 07.05.2024
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Year of Publication 07.05.2024
Patent
Development of Large Die Fine-Pitch Cu/Low-[Formula Omitted] FCBGA Package With Through Silicon via (TSV) Interposer
Chai, Tai Chong, Zhang, Xiaowu, Lau, John H, Selvanayagam, Cheryl S, Damaruganath, Pinjala, Hoe, Yen Yi Germaine, Ong, Yue Ying, Rao, Vempati Srinivas, Wai, Eva, Li, Hong Yu, Liao, E. Bin, Ranganathan, Nagarajan, Vaidyanathan, Kripesh, Liu, Shiguo, Sun, Jiangyan, Ravi, Mullapudi, Vath, Charles J, Tsutsumi, Yoshihiro
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2011)
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Journal Article
Adjustable anchor for printed circuit board environmental sensor
Gupta, Rohit Dev, Ghouse, Mohammed, Pinjala, Damaruganath, Cap, Mehmet Onder, Nayak, Shailesh
Year of Publication 09.05.2023
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Year of Publication 09.05.2023
Patent
ADJUSTABLE ANCHOR FOR PRINTED CIRCUIT BOARD ENVIRONMENTAL SENSOR
GHOUSE, Mohammed, PINJALA, Damaruganath, CAP, Mehmet, Onder, GUPTA, Rohit, Dev, NAYAK, Shailesh
Year of Publication 01.02.2023
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Year of Publication 01.02.2023
Patent
Integrated Optical Carrier for Optical/Electrical Interconnect
Lim Teck Guan, Khoo Yee Mong, Yoon, Joey Chai Yi, Liang, Calivn Teo Wei, Yi, Germaine Hoe Yen, Yap Guan Jie, Ramana, P V, Tan Chee Wei, Damaruganath, P
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2011)
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Journal Article
CORROSION PREVENTIVE HEATSINK FOR NETWORK DEVICE
Shivashankara, Manjunatha Reddy, Mehdiratta, Sandeep, Cap, Mehmet Onder, Pinjala, Damaruganath, Boopalan, Manigandan, Goergen, Joel Richard
Year of Publication 10.03.2022
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Year of Publication 10.03.2022
Patent
Adjustable anchor for printed circuit board environmental sensor
Gupta, Rohit Dev, Ghouse, Mohammed, Pinjala, Damaruganath, Cap, Mehmet Onder, Nayak, Shailesh
Year of Publication 22.02.2022
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Year of Publication 22.02.2022
Patent
Corrosion preventive heatsink for network device
Shivashankara, Manjunatha Reddy, Mehdiratta, Sandeep, Cap, Mehmet Onder, Pinjala, Damaruganath, Boopalan, Manigandan, Goergen, Joel Richard
Year of Publication 25.01.2022
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Year of Publication 25.01.2022
Patent
ADJUSTABLE ANCHOR FOR PRINTED CIRCUIT BOARD ENVIRONMENTAL SENSOR
Gupta, Rohit Dev, Ghouse, Mohammed, Pinjala, Damaruganath, Cap, Mehmet Onder, Nayak, Shailesh
Year of Publication 20.01.2022
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Year of Publication 20.01.2022
Patent
ADJUSTABLE ANCHOR FOR PRINTED CIRCUIT BOARD ENVIRONMENTAL SENSOR
GUPTA, Rohit, GHOUSE, Mohammed, PINJALA, Damaruganath, CAP, Mehmet, NAYAK, Shailesh
Year of Publication 09.04.2020
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Year of Publication 09.04.2020
Patent