Search Results - "Dalal, Hormazdyar" :: K.UTB vyhledávací portál

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$Refractory metal capped low resistivity metal conductor lines and vias formed using pvd and cvd$

Refractory metal capped low resistivity metal conductor lines and vias formed using pvd and cvd

by CUOMO, JEROME, J, JOSHI, RAJIV, V, HSU, LOUIS, L, DALAL, HORMAZDYAR, DALAL, M
Year of Publication 19.12.1997

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Shielded semiconductor device structure

by PRASAD JAGDISH, DALAL HORMAZDYAR M
Year of Publication 17.09.2013

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REFRACTORY METAL CAPPED LOW RESISTIVITY METAL CONDUCTOR LINES AND VLAS FORMED FORMED

by CUOMO, JEROME J, JOSHI, RAJIV V, DALAL, HORMAZDYAR M, HSU, LOUIS L
Year of Publication 07.04.1998

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SHIELDED SEMICONDUCTOR DEVICE STRUCTURE

by PRASAD JAGDISH, DALAL HORMAZDYAR M
Year of Publication 17.05.2012

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Method of forming a shielded semiconductor device and structure therefor

by Dalal, Hormazdyar M, Prasad, Jagdish
Year of Publication 06.03.2012

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Method of forming a shielded semiconductor device and structure therefor

by PRASAD JAGDISH, DALAL HORMAZDYAR M
Year of Publication 06.03.2012

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METHOD OF FORMING A SHIELDED SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR

by PRASAD JAGDISH, DALAL HORMAZDYAR M
Year of Publication 14.01.2010

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Method of forming a shielded semiconductor device and structure therefor

by PRASAD, JAGDISH, DALAL, HORMAZDYAR M
Year of Publication 11.03.2015

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Thick metal interconnect with metal pad caps at selective sites and process for making the same

by PRASAD JAGDISH, ZIAD HOCINE BOUZID, DALAL HORMAZDYAR MINOCHER
Year of Publication 24.05.2011

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Thick metal interconnect with metal pad caps at selective sites and process for making the same

by Dalal, Hormazdyar Minocher, Prasad, Jagdish, Ziad, Hocine Bouzid
Year of Publication 24.05.2011

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Thick metal interconnect with metal pad caps at selective sites and process for making the same

by Dalal, Hormazdyar Minocher, Prasad, Jagdish, Ziad, Hocine Bouzid
Year of Publication 21.09.2010

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Thick metal interconnect with metal pad caps at selective sites and process for making the same

by PRASAD JAGDISH, ZIAD HOCINE BOUZID, DALAL HORMAZDYAR MINOCHER
Year of Publication 21.09.2010

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Thick metal interconnect with metal pad caps at selective sites and process for making the same

by PRASAD JAGDISH, ZIAD HOCINE BOUZID, DALAL HORMAZDYAR MINOCHER
Year of Publication 18.06.2009

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Thick metal interconnect with metal pad caps at selective sites and process for making the same

by PRASAD JAGDISH, ZIAD HOCINE BOUZID, DALAL HORMAZDYAR MINOCHER
Year of Publication 18.06.2009

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Method of forming a shielded semiconductor device and structure therefor

by PRASAD, JAGDISH, DALAL, HORMAZDYAR M
Year of Publication 16.06.2010

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Multi-level electronic package and method for making same

by Dalal, Hormazdyar M, Gaudenzi, Gene Joseph
Year of Publication 09.09.2003

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Multi-level electronic package and method for making same

by DALAL HORMAZDYAR M, GAUDENZI GENE JOSEPH
Year of Publication 09.09.2003

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Method of making and laterally filling key hole structure for ultra fine pitch conductor lines

by DALAL; HORMAZDYAR MINOCHER, RATHORE; HAZARA SINGH
Year of Publication 02.11.1999

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Direct chip attach circuit card

by DALAL; HORMAZDYAR MINOCHER, FALLON; KENNETH MICHAEL
Year of Publication 18.08.1998

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Durch PVD und DVD gebildete, mit hochschmelzendem Metall abgedeckte Metallleiterbahnen und Durchgangslöcher mit niedrigem spezifischen Widerstand

by CUOMO, JEROME J, JOSHI, RAJIV V, DALAL, HORMAZDYAR M, HSU, LOUIS L
Year of Publication 15.09.2005

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