Optimization of Heat-Dissipation Structure of High-Power Diode Laser in Space Environments
Cheng, Lei, Sun, Huaqing, Dai, Xuanjun, Wei, Bingxing
Published in Micromachines (Basel) (29.07.2024)
Published in Micromachines (Basel) (29.07.2024)
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Journal Article
Effect of Thermal Aging on the Reliability of Interconnected Nano-Silver Solder Joints
Tian, Yangning, Jian, Xiaodong, Zhao, Mingrui, Liu, Jiahao, Dai, Xuanjun, Zhou, Bin, Yang, Xiaofeng
Published in Crystals (Basel) (01.12.2023)
Published in Crystals (Basel) (01.12.2023)
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Journal Article
Near-perfect healing natures of silver five-fold twinned nanowire
Liang, Tianshou, Shi, Pengpeng, Su, Sanqing, Zhang, Xiaolong, Dai, Xuanjun
Published in Computational materials science (01.10.2020)
Published in Computational materials science (01.10.2020)
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Journal Article
Analysis of factors affecting the outgassing rate of MEMS vacuum packaging materials
Yang, Yong, Zhou, Bin, Dai, Xuanjun, Huang, Yun
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Investigation of bias stress degradation of Depletion-Mode (D-Mode) AlGaN/GaN HEMT
Guo, Chenrun, Zhou, Bin, Lai, Canxiong, Jian, Xiaodong, Dong, Xianshan, Dai, Xuanjun
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding