by Lu, J.H., Lei, H.Y., Dai, C.S.
Published in International journal of thermal sciences (01.08.2018)

by Lu, J.H., Lei, H.Y., Dai, C.S.
Published in International journal of thermal sciences (01.01.2019)

by Lu, J.H., Lei, H.Y., Dai, C.S.
Published in International journal of heat and mass transfer (01.11.2018)

by Lu, J.H., Lei, H.Y., Dai, C.S.
Published in Chemical engineering science (18.05.2019)

by Lu, J.H., Lei, H.Y., Dai, C.S.
Published in International journal of heat and mass transfer (01.11.2017)

by DAI, C. S, WANG, D. L, HU, X. G, DING, F
Published in Journal of applied electrochemistry (01.03.2005)

by Lu, J.H., Lei, H.Y., Dai, C.S.
Published in International journal of thermal sciences (01.06.2017)

by Lu, J.H., Lei, H.Y., Dai, C.S.
Published in International journal of heat and mass transfer (01.04.2019)

by Dai, C.S., Li, Meng, Lei, H.Y., Wang, S.X.
Published in International journal of thermal sciences (01.09.2015)

by Wang, Q.X., Lei, H.Y., Wang, S.X., Dai, C.S.
Published in Applied thermal engineering (05.11.2014)

by Dai, C.S., Zhang, B., Wang, D.L., Yi, T.F., Hu, X.G.
Published in Materials chemistry and physics (10.10.2006)