Diarctigenin, a Lignan Constituent from Arctium lappa, Down-Regulated Zymosan-Induced Transcription of Inflammatory Genes through Suppression of DNA Binding Ability of Nuclear Factor-κB in Macrophages
Byung Hak Kim, Seong Su Hong, Soon Woo Kwon, Hwa Young Lee, Hyeran Sung, In-Jeong Lee, Bang Yeon Hwang, Sukgil Song, Chong-Kil Lee, Daehyun Chung, Byeongwoo Ahn, Sang-Yoon Nam, Sang-Bae Han, Youngsoo Kim
Published in The Journal of pharmacology and experimental therapeutics (01.11.2008)
Published in The Journal of pharmacology and experimental therapeutics (01.11.2008)
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Journal Article
Diarctigenin, a lignan constituent from Arctium lappa, down-regulated zymosan-induced transcription of inflammatory genes through suppression of DNA binding ability of nuclear factor-kappaB in macrophages
Kim, Byung Hak, Hong, Seong Su, Kwon, Soon Woo, Lee, Hwa Young, Sung, Hyeran, Lee, In-Jeong, Hwang, Bang Yeon, Song, Sukgil, Lee, Chong-Kil, Chung, Daehyun, Ahn, Byeongwoo, Nam, Sang-Yoon, Han, Sang-Bae, Kim, Youngsoo
Published in The Journal of pharmacology and experimental therapeutics (01.11.2008)
Published in The Journal of pharmacology and experimental therapeutics (01.11.2008)
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Journal Article
Research on genome characteristics for minimal genome designing tool in Streptococcus
Rhee, Chung Sei, L'Yi, Sehi, Hong, Whi Ju, Jeong, Sehee, Chung, DaeHyun, Kim, Young-Chang
Published in Proceedings of the International Conference on Bioinformatics & Computational Biology (BIOCOMP) (01.01.2013)
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Published in Proceedings of the International Conference on Bioinformatics & Computational Biology (BIOCOMP) (01.01.2013)
Conference Proceeding
Near zero SSN power delivery networks using Constant Voltage Power Transmission Lines
Huh, S., Chung, D., Swaminathan, M.
Published in 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) (01.12.2009)
Published in 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) (01.12.2009)
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Conference Proceeding
Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications : The elctrical of packages and interconnects
CHOI, Jinwoo, DONG GUN KAM, CHUNG, Daehyun, SRINIVASAN, Krishna, GOVIND, Vinu, KIM, Joungho, SWAMINATHAN, Madhavan
Published in IEEE transactions on advanced packaging (2007)
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Published in IEEE transactions on advanced packaging (2007)
Journal Article
AC coupling circuits including resistive feedback and related methods and devices
Chung, Daehyun, Kim, Sihong, Kim, Jingook, Park, Kwangil, Bae, Seungjun, Lee, Jaehyung
Year of Publication 17.08.2010
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Year of Publication 17.08.2010
Patent
AC coupling circuits including resistive feedback and related methods and devices
KIM SIHONG, LEE JAEHYUNG, PARK KWANGIL, KIM JINGOOK, BAE SEUNGJUN, CHUNG DAEHYUN
Year of Publication 17.08.2010
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Year of Publication 17.08.2010
Patent
AC Coupling Circuits Including Resistive Feedback and Related Methods and Devices
KIM SIHONG, LEE JAEHYUNG, PARK KWANGIL, KIM JINGOOK, BAE SEUNGJUN, CHUNG DAEHYUN
Year of Publication 16.07.2009
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Year of Publication 16.07.2009
Patent
High frequency electrical circuit model of chip-to-chip vertical via interconnection for 3-D chip stacking package
Chunghyun Ryu, Daehyun Chung, Junho Lee, Kwangyong Lee, Taesung Oh, Kim, Joungho
Published in IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005 (2005)
Published in IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005 (2005)
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Conference Proceeding