Search Results - "Dae-Lok Bae" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

The formation of Ti-polycide gate structure with high thermal stability using chemical-mechanical polishing (CMP) planarization technology

The formation of Ti-polycide gate structure with high thermal stability using chemical-mechanical polishing (CMP) planarization technology

by Hyoung-Sub Kim, Dae-Hong Ko, Dae-Lok Bae, Fujihara, K., Ho-Kyu Kang
Published in IEEE electron device letters (01.02.1999)

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Journal Article

Direct Copper Electroless Deposition on a Tungsten Barrier Layer for Ultralarge Scale Integration

Direct Copper Electroless Deposition on a Tungsten Barrier Layer for Ultralarge Scale Integration

by Kim, Young-Soon, Bae, Dae-Lok, Yang, Hoichang, Shin, Hyung-Shik, Wang, G W, Senkevich, J J, Lu, T-M
Published in Journal of the Electrochemical Society (01.01.2005)

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Journal Article

Adhesion of Sputter-Deposited Ta to Porous-Methyl Silsesquioxane Pore Sealed with Molecular Caulk

Adhesion of Sputter-Deposited Ta to Porous-Methyl Silsesquioxane Pore Sealed with Molecular Caulk

by Bae, D.-L., Jezewski, C., Cale, T. S., Senkevich, J. J.
Published in Chemical vapor deposition (01.04.2005)

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Journal Article

Erratum: Direct Copper Electroless Deposition on a Tungsten Barrier Layer for Ultralarge Scale Integration [J. Electrochem. Soc., 152, C89 (2005)]

Erratum: Direct Copper Electroless Deposition on a Tungsten Barrier Layer for Ultralarge Scale Integration [J. Electrochem. Soc., 152, C89 (2005)]

by Kim, Young-Soon, Bae, Dae-Lok, Yang, Hoichang, Shin, Hyung-Shik, Wang, G-W, Senkevich, J J, Lu, T-M
Published in Journal of the Electrochemical Society (01.01.2005)

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Journal Article

Semiconductor device and method of fabricating the same

Semiconductor device and method of fabricating the same

by Choi Gil-heyun, Lim Dong-chan, Moon Kwang-jin, Bae Dae-lok, Park Byung-lyul, Jung Deok-young, Kang Pil-kyu
Year of Publication 28.11.2017

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Patent

Semiconductor devices having optical transceiver

Semiconductor devices having optical transceiver

by CHOI GIL-HEYUN, BAE DAE-LOK, KANG PIL-KYU, PARK BYUNG-LYUL
Year of Publication 11.08.2015

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Patent

Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions

Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions

by CHA YONG-WON, BAE DAE-LOK
Year of Publication 24.08.2010

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Patent

Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions

Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions

by Cha, Yong-Won, Bae, Dae-Lok
Year of Publication 24.08.2010

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Patent

Semiconductor device and method of fabricating the same

Semiconductor device and method of fabricating the same

by Choi Gil-heyun, Lim Dong-chan, Moon Kwang-jin, Bae Dae-lok, Park Byung-Iyul, Jung Deok-young, Kang Pil-kyu
Year of Publication 27.12.2016

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Patent

Buried-type optical input/output devices and methods of manufacturing the same

Buried-type optical input/output devices and methods of manufacturing the same

by CHOI GIL-HEYUN, BAE DAE-LOK, KANG PIL-KYU, PARK BYUNG-LYUL
Year of Publication 28.10.2014

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Patent

Optical input/output device for photo-electric integrated circuit device and method of fabricating same

Optical input/output device for photo-electric integrated circuit device and method of fabricating same

by BAE DAE LOK, KANG PIL-KYU, CHOI GIL HEYUN, LEE JONG MYEONG
Year of Publication 21.10.2014

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Patent

Methods of selectively forming silicon-on-insulator structures using selective expitaxial growth process

Methods of selectively forming silicon-on-insulator structures using selective expitaxial growth process

by LEE JONG-MYEONG, CHOI GIL-HEYUN, BAE DAE-LOK, KANG PIL-KYU
Year of Publication 27.05.2014

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Patent

Method for forming light guide layer in semiconductor substrate

Method for forming light guide layer in semiconductor substrate

by MOON KWANG-JIN, CHOI GIL-HEYUN, BAE DAE-LOK, KANG PIL-KYU, PARK BYUNG-LYUL
Year of Publication 01.10.2013

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Patent

OPTICAL INPUT/OUTPUT DEVICE FOR PHOTO-ELECTRIC INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING SAME

OPTICAL INPUT/OUTPUT DEVICE FOR PHOTO-ELECTRIC INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING SAME

by BAE DAE LOK, KANG PIL-KYU, CHOI GIL HEYUN, LEE JONG MYEONG
Year of Publication 29.08.2013

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Patent

Semiconductor Device and Method of Fabricating the Same

Semiconductor Device and Method of Fabricating the Same

by MOON KWANG-JIN, CHOI GIL-HEYUN, BAE DAE-LOK, JUNG DEOK-YOUNG, KANG PIL-KYU, LIM DONGAN, PARK BYUNG-LYUL
Year of Publication 07.08.2014

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Patent

Optical input/output device for photo-electric integrated circuit device and method of fabricating same

Optical input/output device for photo-electric integrated circuit device and method of fabricating same

by BAE DAE LOK, KANG PIL-KYU, CHOI GIL HEYUN, LEE JONG MYEONG
Year of Publication 16.04.2013

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Patent

Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions

Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions

by CHA YONG-WON, BAE DAE-LOK
Year of Publication 22.11.2007

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Patent

METHOD OF FORMING AN ISOLATION LAYER OF A SEMICONDUCTOR DEVICE

METHOD OF FORMING AN ISOLATION LAYER OF A SEMICONDUCTOR DEVICE

by CHA, YONG WON, BAE, DAE LOK
Year of Publication 04.10.2007

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Patent

Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate

Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate

by CHOI GIL-HEYUN, BAE DAE-LOK, KANG PIL-KYU, LEE DONG-KAK, PARK BYUNG-LYUL
Year of Publication 15.01.2013

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Patent

Wafer temporary bonding method using silicon direct bonding

Wafer temporary bonding method using silicon direct bonding

by Kim, Jung-ho, Bae, Dae-lok, Lee, Jong-wook, Choi, Seung-woo, Kang, Pil-kyu
Year of Publication 01.01.2013

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Patent