An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate
Seo, Sun-Kyoung, Kang, Sung K., Shih, Da-Yuan, Lee, Hyuck Mo
Published in Journal of electronic materials (01.02.2009)
Published in Journal of electronic materials (01.02.2009)
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Conference Proceeding
Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys
Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.11.2002)
Published in Journal of materials research (01.11.2002)
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Oxidation study of pure tin and its alloys via electrochemical reduction analysis
CHO, Sungil, JIN YU, KANG, Sung K, SHIH, Da-Yuan
Published in Journal of electronic materials (01.05.2005)
Published in Journal of electronic materials (01.05.2005)
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Journal Article
Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
KANG, Sung K, LEONARD, Donovan, SHIH, Da-Yuan, GIGNAC, Lynne, HENDERSON, D. W, CHO, Sungil, JIN YU
Published in Journal of electronic materials (01.03.2006)
Published in Journal of electronic materials (01.03.2006)
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Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
Kang, Sung K., Shih, Da-Yuan, Leonard, Donovan, Henderson, Donald W., Gosselin, Timothy, Cho, Sung-il, Yu, Jin, Choi, Won K.
Published in JOM (1989) (01.06.2004)
Published in JOM (1989) (01.06.2004)
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Journal Article
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
Kang, Sung K., Shih, Da-Yuan, Donald, NY, Henderson, W., Gosselin, Timothy, Sarkhel, Amit, Charles Goldsmith, NY, Puttlitz, Karl J., Choi, Won Kyoung
Published in JOM (1989) (01.06.2003)
Published in JOM (1989) (01.06.2003)
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Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
Kang, Sung K., Cho, M.G., Lauro, P., Shih, Da-Yuan
Published in Journal of materials research (01.03.2007)
Published in Journal of materials research (01.03.2007)
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Journal Article
Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging
MOON GI CHO, KANG, Sung K, SHIH, Da-Yuan, HYUCK MO LEE
Published in Journal of electronic materials (01.11.2007)
Published in Journal of electronic materials (01.11.2007)
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Conference Proceeding
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Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders
LAURO, Paul, KANG, Sung K, WON KYOUNG CHOI, SHIH, Da-Yuan
Published in Journal of electronic materials (01.12.2003)
Published in Journal of electronic materials (01.12.2003)
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Journal Article
Comparison of electromigration behaviors of SnAg and SnCu solders
Minhua Lu, Da-Yuan Shih, Goldsmith, C., Wassick, T.
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
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The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy
Seo, Sun-Kyoung, Kang, Sung K., Cho, Moon Gi, Shih, Da-Yuan, Lee, Hyuck Mo
Published in Journal of electronic materials (01.12.2009)
Published in Journal of electronic materials (01.12.2009)
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Conference Proceeding
The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue
Henderson, Donald W., Woods, James J., Gosselin, Timothy A., Bartelo, Jay, King, David E., Korhonen, T.M., Korhonen, M.A., Lehman, L.P., Cotts, E.J., Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.06.2004)
Published in Journal of materials research (01.06.2004)
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Journal Article
Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging
Cho, Moon Gi, Kang, Sung K., Seo, Sun-Kyoung, Shih, Da-Yuan, Lee, Hyuck Mo
Published in Journal of electronic materials (01.11.2009)
Published in Journal of electronic materials (01.11.2009)
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Conference Proceeding
Generic rules to achieve bump electromigration immortality for 3D IC integration
Hsiao-Yun Chen, Da-Yuan Shih, Cheng-Chang Wei, Chih-Hang Tung, Yi-Li Hsiao, Yu, Douglas Cheng-Hua, Yu-Chun Liang, Chih Chen
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Critical Factors Affecting the Undercooling of Pb-free, Flip-Chip Solder Bumps and In-situ Observation of Solidification Process
Kang, S.K., Moon Gi Cho, Lauro, P., Da-Yuan Shih
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding