Moisture resistant aluminum nitride filler for high thermal conductivity microelectronic molding compounds
Gallo, A.A., Bischof, C.S., Howard, K.E., Dunmead, S.D., Anderson, S.A.
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
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Conference Proceeding
Journal Article
Carbothermally prepared nanophase (SiC/Si 3 N 4) composite powders and densified parts
Carroll, Daniel F, Weimer, Alan W, Dunmead, Stephen D, Eisman, Glenn A
Published in AIChE journal (01.01.1997)
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Published in AIChE journal (01.01.1997)
Journal Article
Carbothermally prepared nanophase SiC/ Si3N4 composite powders and densified parts
Carroll, Daniel F., Weimer, Alan W., Dunmead, Stephen D., Eisman, Glenn A., Hwang, James H., Cochran, Gene A., Susnitzky, David W., Beaman, Donald R., Conner, Cynthia L.
Published in AIChE journal (1997)
Published in AIChE journal (1997)
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Journal Article
Conference Proceeding
Gas-solid reactions under a self-propagating combustion mode
Munir, Zuhair A., Dunmead, Stephen D., Davis, UC, Holt, J.Birch
Published in Solid state ionics (01.03.1988)
Published in Solid state ionics (01.03.1988)
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Journal Article