Building reliable FE simulation models for a better behavior prediction of power electronic systems
Moller, Heiner, Dudek, Rainer, Otto, Alexander, Rzepka, Sven
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Modelling the Lifetime of Heavy Wire-bonds in Power Devices - Concepts, Limitations and Challenges
Otto, Alexander, Dudek, Rainer, Kolas, Kshitij, Mathew, Anu, Scherf, Christina, Rzepka, Sven
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results
Dudek, Rainer, Kreyssig, Kerstin, Rzepka, Sven, Novak, Michael, Gruebl, Wolfgang, Fruehauf, Peter, Weigert, Andreas
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
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Conference Proceeding
Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation
Brueckner, John, Dehé, Alfons, Auerswald, Ellen, Dudek, Rainer, Vogel, Dietmar, Michel, Bernd, Rzepka, Sven
Published in Microsystem technologies : sensors, actuators, systems integration (01.03.2016)
Published in Microsystem technologies : sensors, actuators, systems integration (01.03.2016)
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Journal Article
Studies on the reliability of power packages based on strength and fracture criteria
Dudek, Rainer, Pufall, Reinhard, Seiler, Bettina, Michel, Bernd
Published in Microelectronics and reliability (01.07.2012)
Published in Microelectronics and reliability (01.07.2012)
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Journal Article
Conference Proceeding
Characterization of partial discharge performance of die attach adhesives
Schaller, Rainer, Strutz, Volker, Theuss, Horst, Dudek, Rainer, Rzepka, Sven
Published in Materials today : proceedings (2017)
Published in Materials today : proceedings (2017)
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Journal Article
Reliability investigations for high temperature interconnects
Dudek, Rainer, Sommer, Peter, Fix, Andreas, Trodler, Joerg, Rzepka, Sven, Michel, Bernd
Published in Soldering & surface mount technology (01.01.2014)
Published in Soldering & surface mount technology (01.01.2014)
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Journal Article
Simulation based analysis of secondary effects on solder fatigue
Dudek, Rainer, Doering, Ralf, Bombach, Christine, Michel, Bernd
Published in Microelectronics and reliability (01.08.2009)
Published in Microelectronics and reliability (01.08.2009)
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Journal Article
Conference Proceeding
An approach of numerical multi-objective optimization in stacked packaging : Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (EuroSimE 2007)
DOWHAN, Lukasz, WYMYSLOWSKI, Artur, DUDEK, Rainer
Published in Microelectronics and reliability (2008)
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Published in Microelectronics and reliability (2008)
Journal Article
An approach of numerical multi-objective optimization in stacked packaging
Dowhań, Łukasz, Wymysłowski, Artur, Dudek, Rainer
Published in Microelectronics and reliability (01.06.2008)
Published in Microelectronics and reliability (01.06.2008)
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Journal Article
Improving the production quality and robustness of a SO16 sensor package by a simulation based digital twin approach
Moeller, Heiner, Knoll, Heiko, Hille, Pascal, Dudek, Rainer, Rzepka, Sven
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Roellig, Mike, Dudek, Rainer, Wiese, Steffen, Boehme, Bjoern, Wunderle, Berhard, Wolter, Klaus-Juergen, Michel, Bernd
Published in Microelectronics and reliability (01.02.2007)
Published in Microelectronics and reliability (01.02.2007)
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Journal Article
Conference Proceeding
Solder Fatigue Analyses and Predictions for PCB Mounted Components after Thirteen Years of Thermal Field Cycling
Dudek, Rainer, Doring, Ralf, Kreysig, Kerstin, Rzepka, Sven, Fruehauf, Peter, Weigert, Andreas
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
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Conference Proceeding
Failure Prediction and Analysis of an IGBT Module for Industrial Applications Subjected to Passive and Power Cycling
Dudek, Rainer, Otto, Alexander, Doring, Ralf, Mathew, Anu, Liu, Xing, Rzepka, Sven
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
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Conference Proceeding
Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints
Vandevelde, Bart, Labie, Riet, Lauwaert, Ralph, Dudek, Rainer, Gromala, Przemyslaw, Eichorst, Michael
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
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Conference Proceeding
Modelling Thermal Fatigue in Power Electronics
Dudek, Rainer, Doring, Ralf, Mathew, Anu, Otto, Alexander, Rzepka, Sven
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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Conference Proceeding
Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation
Dudek, Rainer, Mathew, Anu, Albrecht, Jan, Scherf, Christina, Rzepka, Sven, Subbiah, Nilavazhagan, Wilde, Jurgen
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
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Conference Proceeding