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Published in Applied surface science (30.06.2009)
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Effects of CCL inorganic filler on hole performance in PCB drilling process
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Thermosetting resin composition, prepreg, laminate, and printed circuit board
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Year of Publication 01.03.2022
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Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit board
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Year of Publication 06.07.2021
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VINYL THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIRCUIT BOARD
LIU, Qianfa, YAN, Shanyin, ZENG, Xianping, DU, Cuiming, CHEN, Guangbin
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Year of Publication 22.12.2021
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THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIRCUIT BOARD
LIU, Qianfa, YAN, Shanyin, ZENG, Xianping, DU, Cuiming, CHEN, Guangbin
Year of Publication 23.06.2021
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Year of Publication 23.06.2021
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THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIRCUIT BOARD
LIU, Qianfa, YAN, Shanyin, ZENG, Xianping, DU, Cuiming, CHEN, Guangbin
Year of Publication 06.08.2020
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Year of Publication 06.08.2020
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VINYL THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIRCUIT BOARD
LIU, Qianfa, YAN, Shanyin, ZENG, Xianping, DU, Cuiming, CHEN, Guangbin
Year of Publication 06.08.2020
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Year of Publication 06.08.2020
Patent
VINYL THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIRCUIT BOARD
LIU, Qianfa, YAN, Shanyin, ZENG, Xianping, DU, Cuiming, CHEN, Guangbin
Year of Publication 05.08.2020
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Year of Publication 05.08.2020
Patent
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIRCUIT BOARD
LIU, Qianfa, YAN, Shanyin, ZENG, Xianping, DU, Cuiming, CHEN, Guangbin
Year of Publication 05.08.2020
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Year of Publication 05.08.2020
Patent