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"DU CUIMING"
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THERMOSETTING RESIN COMPOUND AND USE THEREOF
by
DU
,
Cuiming
Year of Publication
22.06.2017
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THERMOSETTING RESIN COMPOSITION AND USE THEREOF
by
HAO, Liangpeng
,
CHAI, Songgang
,
DU
,
Cuiming
Year of Publication
28.06.2017
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THERMOSETTING RESIN COMPOSITION AND USE THEREOF
by
DU
,
CUIMING
,
HAO, LIANGPENG
,
CHAI, SONGGANG
Year of Publication
17.08.2016
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THERMOSETTING RESIN COMPOSITION AND USES THEREOF
by
HAO Liangpeng
,
DU Cuiming
,
CHAI Songgang
Year of Publication
11.08.2016
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Thermosetting resin composition, prepreg containing same, laminated board and printed circuit board
by
CHEN WENXIN
,
DU CUIMING
,
CHAI SONGGANG
Year of Publication
24.02.2016
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26
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TWI658929B
by
DU
,
CUIMING
,
CHAI, SONGGANG
Year of Publication
11.05.2019
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27
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Prepreg, laminated board and printed circuit board
by
DU CUIMING
,
CHAI SONGGANG
Year of Publication
01.06.2018
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EPOXY RESIN COMPOSITION AND COPPER CLAD LAMINATE MANUFACTURED BY USING SAME
by
YANG ZHONGQIANG
,
DU CUIMING
,
CHAI SONGGANG
Year of Publication
07.11.2013
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Multilayer printed circuit board
by
DU CUIMING
,
CHAI SONGGANG
Year of Publication
24.05.2017
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Thermosetting resin composition, prepreg, laminated board and printed circuit board
by
HAO LIANGPENG
,
CHAI SONGGANG
,
LIU QIANFA
,
DU CUIMING
Year of Publication
18.01.2019
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Filler composition and application thereof
by
HAO LIANGPENG
,
XING YANXIA
,
CHEN WENXIN
,
DU CUIMING
,
CHAI SONGGANG
Year of Publication
29.04.2015
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Filler compound and copper clad laminate made of same
by
DU CUIMING
Year of Publication
12.10.2011
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Thermosetting resin composition, prepreg, laminate and printed circuit board (PCB)
by
YAN SHANYIN
,
CHEN GUANGBING
,
ZENG XIANPING
,
LIU QIANFA
,
DU CUIMING
Year of Publication
07.06.2019
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Vinyl thermosetting resin composition, prepreg, laminated board and printed circuit board
by
YAN SHANYIN
,
CHEN GUANGBING
,
ZENG XIANPING
,
LIU QIANFA
,
DU CUIMING
Year of Publication
04.06.2019
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THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD CONTAINING SAME
by
XING, Yanxia
,
HAO, Liangpeng
,
CHAI, Songgang
,
DU
,
Cuiming
Year of Publication
29.06.2017
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THERMOSETTING RESIN COMPOSITION AND PREPREG CONTAINING SAME, AND LAMINATED PLATE AND PRINTED CIRCUIT BOARD
by
XING, Yanxia
,
HAO, Liangpeng
,
CHAI, Songgang
,
DU
,
Cuiming
Year of Publication
22.06.2017
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THERMOSETTING RESIN COMPOSITION, PREPREG CONTAINING SAME, LAMINATED BOARD, AND PRINTED CIRCUIT BOARD
by
CHAI, Songgang
,
DU
,
Cuiming
,
CHEN, Wenxin
Year of Publication
15.06.2017
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Laminated board, metal foil-coated laminated board and multilayer printed circuit board
by
XU YONGJING
,
DU CUIMING
,
CHAI SONGGANG
Year of Publication
26.04.2017
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THERMOSETTING RESIN COMPOSITION AND USES THEREOF
by
DU
,
CUIMING
,
CHAI, SONGGANG
Year of Publication
07.05.2015
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Glass fabric-based prepreg and preparation method thereof, laminated board and printed circuit board
by
HU PENG
,
HAO LIANGPENG
,
XING YANXIA
,
CHAI SONGGANG
,
DU CUIMING
Year of Publication
15.06.2018
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